Applied Materials, Inc.

Elevated Materials US LLC

Jean Delmas

Steven Verhaverbeke

Han-Wen Chen

Kurtis Leschkies

Roman Gouk

Giback Park

Chintan Buch

Bernard Frey

Wei-Sheng Lei

Kyuil Cho

Vincent Dicaprio

Bernhard Stonas

Jeffrey L Franklin

Charles T Carlson

Robert Brent Vopat

Subramanya P Herle

Ezhiylmurugan Rangasamy

Girish Kumar Gopalakrishnan Nair

The present disclosure relates to systems and methods for fabricating semiconductor packages, and more particularly, for forming features in semiconductor packages by laser ablation. In one embodiment, the laser systems and methods described herein can be utilized to pattern a substrate to be utilized as a package frame for a semiconductor package having one or more interconnections formed therethrough and/or one or more semiconductor dies disposed therein. The laser systems described herein can produce tunable laser beams for forming features in a substrate or other package structure. Specifically, frequency, pulse width, pulse shape, and pulse energy of laser beams are tunable based on desired sizes of patterned features and on the material in which the patterned features are formed. The adjustability of the laser beams enables rapid and accurate formation of features in semiconductor substrates and packages with controlled depth and topography.

Laser ablation system for package fabrication

A method and system for fabricating a pre-lithiated electrode structure are provided. The method includes supplying a first continuous web substrate from an unwinder roller to a winder roller. The first continuous web substrate includes a layer of lithium metal. The method further includes supplying a second continuous web substrate comprising a layer of patterned anode material adjacent to the first continuous web substrate. The first continuous web substrate and the second continuous web substrate are wound together on the unwinder roller, wherein a surface of the layer of anode material contacts a surface of the layer of lithium metal. Pressure is applied to the first continuous web substrate and the second continuous web substrate to pre-lithiate the patterned anode material, wherein applying pressure comprises tensioning at least one of the unwinder roller and the winder roller.

Inline contact pre-lithiation

The present disclosure relates to semiconductor core assemblies and methods of forming the same. The semiconductor core assemblies described herein may be utilized to form semiconductor package assemblies, PCB assemblies, PCB spacer assemblies, chip carrier assemblies, intermediate carrier assemblies (e.g., for graphics cards), and the like. In one embodiment, a silicon substrate core is structured by direct laser patterning. One or more conductive interconnections are formed in the substrate core and one or more redistribution layers are formed on surfaces thereof. The silicon substrate core may thereafter be utilized as a core structure for a semiconductor package, PCB, PCB spacer, chip carrier, intermediate carrier, or the like.

Package core assembly and fabrication methods

Methods and systems for the production and delivery of lithium metal of high purity are provided herein. In one or more embodiments, method for flowing liquid lithium to a processing chamber is provided and includes flowing liquid lithium from a lithium refill container to a liquid lithium delivery module, where the liquid lithium delivery module is fluidly coupled to the lithium refill container, and flowing the liquid lithium from the liquid lithium delivery module to the processing chamber. The liquid lithium delivery module contains a lithium storage region operable to store liquid lithium and containing a fluid supply line fluidly coupling an outlet port of a liquid lithium storage tank, and a flow meter positioned downstream from the lithium storage region along the fluid supply line and operable to monitor the flow of the liquid lithium through the fluid supply line.

Liquid lithium supply and regulation

An imprint lithography stamp includes a stamp body having a patterned surface and formed from a fluorinated ethylene propylene copolymer. The imprint lithography stamp further includes a backing plate with a plurality of through-holes with portions of the stamp body extending into the through-holes to adhere the stamp body to the backing plate. The patterned surface of the stamp body has a plurality of protrusions extending from the stamp body, which are used to form high aspect ratio features at high processing temperatures. A mold design for forming the imprint lithography stamp and an injection molding process for forming the imprint lithography stamp are also provided.

Fluoropolymer stamp fabrication method

Embodiments of the disclosure relate to an apparatus and method for annealing one or more semiconductor substrates. In one embodiment, a processing chamber is disclosed. The processing chamber includes a chamber body enclosing an internal volume, a substrate support disposed in the internal volume and configured to support a substrate during processing, a gas panel configured to provide a processing fluid into the internal volume, and a temperature-controlled fluid circuit configured to maintain the processing fluid at a temperature above a condensation point of the processing fluid. The temperature-controlled fluid circuit includes a gas conduit fluidly coupled to a port on the chamber body at a first end and to the gas panel at a second end.

High pressure and high temperature anneal chamber

Embodiments described herein relate to a high pressure processing system with a condenser and methods for utilizing the same. The processing system includes a process chamber, a boiler, a condenser, and one or more heat exchangers. The boiler generates a fluid, such as a vapor or supercritical fluid, and delivers the fluid to the process chamber where a substrate is processed. After processing the substrate, the system is depressurized and the fluid is delivered to the condenser where the fluid is condensed.

Condenser system for high pressure processing system

Methods and systems for the production and delivery of lithium metal of high purity are provided herein. In one or more embodiments, a liquid lithium delivery system contains a liquid lithium delivery module fluidly coupled to a lithium refill container. The liquid lithium delivery module contains a lithium storage region operable to store liquid lithium and containing a fluid supply line fluidly coupling an outlet port of a liquid lithium storage tank, and a flow meter positioned downstream from the lithium storage region along the fluid supply line and operable to monitor the flow of the liquid lithium through the fluid supply line.

Disclosed herein is an apparatus and method for annealing semiconductor substrates. In one example the method of annealing substrates in a processing chamber includes loading a plurality of substrates into an internal volume of the processing chamber. The method includes flowing a processing fluid through a gas conduit into the internal volume. The method further includes measuring a temperature of the gas conduit at one or more position utilizing one or more temperature sensors. The processing fluid in the gas conduit and the internal volume are maintained at a temperature above a condensation point of the processing fluid.

Disclosed herein is an apparatus and method for annealing semiconductor substrates. In one example a temperature-controlled fluid circuit includes a condenser configured to fluidly connect to an internal volume of a processing chamber. The processing chamber has a body, the internal volume is within the body. The condenser is configured to condense a processing fluid into liquid phase. A source conduit includes a first terminal end that couples to a first port on the body of the processing chamber. The source conduit includes a second terminal end. The first terminal end couples to a gas panel. The gas panel is configured to provide a processing fluid into the internal volume of the processing chamber. A gas conduit includes a first end. The first end couples to the condenser and a second end. The second end is configured to couple to a second port on the body of the processing chamber.

Embodiments described herein generally relate to a processing chamber incorporating a small thermal mass which enable efficient temperature cycling for supercritical drying processes. The chamber generally includes a body, a liner, and an insulation element which enables the liner to exhibit a small thermal mass relative to the body. The chamber is also configured with suitable apparatus for generating and/or maintaining supercritical fluid within a processing volume of the chamber.

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Santa Clara, CA, United States of America

Jean Delmas