Thomson-csf

Jean-Claude Resneau

Jean Doyen

Raymond Henry

Jean-Victor Bouvet

Robert Ribier

Pierre Roset

The substrate is formed by a plate of boron nitride having a composition of 42% B, 53.5% N.sub.2, containing between 1.5 and 2.5% O.sub.2, and 1.5% Ca. The surface is increased in hardness and made non-friable by deposition of a glass film to a depth within the range of 10 to 15 microns. This deposit permits surface metallization and ensures cohesion of the boron nitride grains.

Substrate for a microwave electronic circuit and a method for the making

A low thermal resistance insulating support permitting thermal stresses in the base of a high power component incorporating a beryllium oxide element without fractures or flaws occurring. The support includes a dissipating support made from copper, whose two large faces are slotted to at least partly house a beryllium oxide disk which receives a component and its connections to the outside. Such also completely houses a molybdenum disk with an expansion coefficient close to that of the beryllium oxide.

Low thermal resistance insulating support and base or box for power

A sealed enclosing system for coupling an emitting or receiving optoelectronic device with an optical fibre. A metal cap has an optical fibre passing therethrough in a sealed manner. A bellows tube is mounted on a base and thus provides an elastic element for connecting the fibre to an optoelectronic diode mounted on the tube. The seal is completed by a welding of the cap to the base and by passing electric supply connections through the passage ways formed by glass beads.

Growing community of inventors

Paris, France

Jean-Claude Resneau