Freescale Semiconductor,inc.

Nxp Usa, Inc.

Jean-Christophe Nanan

Jeffrey Kevin Jones

Gerard J Bouisse

Basim H Noori

Jaime A Pla

Hugues Beaulaton

Joseph Staudinger

Lakshminarayan Viswanathan

Damon G Holmes

David James Dougherty

Scott Duncan Marshall

Jean-Jacques Bouny

Cedric Cassan

Xavier Hue

Scott Maarshall

David Dougherty

Embodiments of Doherty Power Amplifier (PA) and other PA packages are provided, as are systems including PA packages. In embodiments, the PA package includes a package body having a longitudinal axis, a first group of input-side leads projecting from a first side of the package body and having an intra-group lead spacing, and a first group of output-side leads projecting from a second side of the package body and also having the intra-group lead spacing. A first carrier input lead projects from the first package body side and is spaced from the first group of input-side leads by an input-side isolation gap, which has a width exceeding the intra-group lead spacing. Similarly, a first carrier output lead projects from the second package body side, is laterally aligned with the first carrier input lead, and is separated from the first group of output-side leads by an output-side isolation gap.

Power amplifier packages and systems incorporating design-flexible package platforms

Apparatus are provided for amplifier systems and related circuits are provided. An exemplary circuit includes a main amplifier arrangement, first impedance matching circuitry coupled between the output of the main amplifier arrangement and a first circuit output, a peaking amplifier arrangement, and second impedance matching circuitry coupled between the output of the peaking amplifier arrangement and a second output of the circuit. In one exemplary embodiment, the first impedance matching circuitry and the second impedance matching circuitry have different circuit topologies and different physical topologies.

Amplifiers and related integrated circuits

Amplfiers and related integrated circuits

Apparatus are provided for amplifier systems and related circuits are provided. An exemplary circuit includes a main amplifier arrangement, first impedance matching circuitry coupled between the output of the main amplifier arrangement and a first output of the circuit, a peaking amplifier arrangement, and second impedance matching circuitry coupled between the output of the peaking amplifier arrangement and a second output of the circuit. In one exemplary embodiment, the first impedance matching circuitry and the second impedance matching circuitry have different circuit topologies and different physical topologies.

An embodiment of an amplifier includes N (N&#x3e;1) switch-mode power amplifier (SMPA) branches. Each SMPA branch includes two drive signal inputs and one SMPA branch output. A module coupled to the amplifier samples an input RF signal, and produces combinations of drive signals based on the samples. When an SMPA branch receives a first combination of drive signals, it produces an output signal at a first voltage level. Conversely, when the SMPA branch receives a different second combination of drive signals, it produces the output signal at a different second voltage level. Finally, when the SMPA branch receives a different third combination of drive signals, it produces the output signal at a voltage level of substantially zero. A combiner combines the output signals from all of the SMPA branches to produce a combined output signal that may have, at any given time, one of 2*N+1 quantization states.

Multiple-state, switch-mode power amplifier systems and methods of their operation

Apparatus are provided for amplifier systems and related integrated circuits are provided. An exemplary integrated circuit includes a main amplifier arrangement, first impedance matching circuitry coupled between the output of the main amplifier arrangement and a first output of the integrated circuit, a peaking amplifier arrangement, and second impedance matching circuitry coupled between the output of the peaking amplifier arrangement and a second output of the integrated circuit. In one exemplary embodiment, the first impedance matching circuitry and the second impedance matching circuitry have different circuit topologies and different physical topologies.

An embodiment of an amplifier includes N (N&#x3e;1) switch-mode power amplifier (SMPA) branches. Each SMPA branch includes two drive signal inputs and one SMPA branch output. A module coupled to the amplifier samples an input RF signal, and produces combinations of drive signals based on the samples. When an SMPA branch receives a first combination of drive signals, it produces an output signal at one voltage level. Conversely, when the SMPA branch receives a different second combination of drive signals, it produces the output signal at another voltage level. At least two of the SMPA branches produce output signals having different absolute magnitudes. A combiner combines the output signals from all of the SMPA branches to produce a combined output signal that may have, at any given time, one of 2*N+1 quantization states.

A communication unit comprises a power DAC. The DAC comprises: a switched mode power amplifier (SMPA); and a digital band-pass sigma-delta modulator operably coupled to the SMPA. The sigma-delta modulator comprises an input to receive an input baseband signal; a delay; an adder module arranged to add a feedback signal with an output from the delay; and at least two feedback branches. The sigma-delta modulator is arranged to digitally oversample the input baseband signal such that a ratio of a sampling frequency employed by the sigma-delta modulator to a radio frequency (RF) output from the DAC is fixed and the sampling frequency tuned or wherein the sampling frequency is fixed and the ratio is adjusted, such that a first feedback branch in the sigma-delta modulator is formed using at least one from a group of: a zero gain, an additive inverse of a second feedback branch.

Growing community of inventors

Toulouse, France

Jean-Christophe Nanan