Commissariat a L'energie Atomique

Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Sorin Crm Sas

Jean-Charles Souriau

Francois Baleras

David Henry

Guy-Michel Parat

Xavier Baillin

Jean Brun

Robert Meyer

Renzo Dal Molin

Stéphane Caplet

Eric Jalaguier

Jean-Pierre Joly

François Marion

Elisabeth Delevoye

Nicolas Sillon

Olivier Constantin

Sophie Verrun

François Baleras

Gilles Poupon

Pierre Renard

Michel Levis

Leaticia Castagne

A flexible electronic structure includes a first film, made of a first polymer or glass, and a second film, made of a second polymer, in which at least one electronic component is arranged. The second film covers the first film. The flexible electronic structure also includes at least one electrically conductive track arranged between the first film and the second film, and each electrically connected to one of the electronic components, by a respective interconnection element. Optionally, the flexible electronic structure includes a third film, made of a third polymer or glass, covering the second film. The interconnection element is arranged near the neutral plane of the structure, and the structure includes at least one compensation layer, so as to position the neutral plane at a desired location.

Flexible electronic structure and method for producing same

The invention relates to a method for integrating structures in a support, which comprises the steps: The peripheral space has a radial extension length which decreases from the rear face to the front face.

Method for integrating structures in a support and associated device

A box for a microelectronic device includes a first portion and a second portion able to be assembled in order to define, in an assembled position, a housing space for the microelectronic device. A face of the first portion is facing a face of the second portion in the assembled position. The first zones facing the faces form an interface for attaching the first portion and second portion. The second zones face faces forming a cavity for receiving the microelectronic device. At least one among the first portion and the second portion includes at least one element for electrical connection. The first portion and the second portion can apply at least one connection pad of the microelectronic device on the element for connection in the assembled position.

Microelectronic device housing bearing on the microelectronic device

A microelectronic wireless transmission device including:

Microelectronic wireless transmission device

A first substrate provided with a receiving area made from a first metallic material is supplied. A second substrate provided with an insertion area comprising a base surface and at least two bumps made from a second metallic material is arranged facing the first substrate. The bumps are salient from the base surface. A pressure is applied between the first substrate and the second substrate so as to make the bumps penetrate into the receiving area. The first metallic material reacts with the second metallic material so as to form a continuous layer of an intermetallic compound having a base formed by the first and second metallic materials along the interface between the bumps and the receiving area.

Method for fabricating two substrates connected by at least one mechanical and electrically conductive connection and structure obtained

A component including at least one active element hermetically encapsulated in a cavity formed between a support and a cover, in which the support and the cover are made from an electrically conductive material, and are insulated electrically from one another, and include a first electrical connection between the active element and the support, and a second electrical connection, separate from the first connection, between the active element and the cover, and in which:

Component with encapsulated active element and implantable medical advice incorporating such a component

The invention relates to an electronic device, having a front faceand a rear face', fitted with at least one discrete integrated component, comprising: a) the active faceof the component appearing to the side of the front face; b) coating material, present at least laterally relative to the component, ensuring the so-called component is held in the device; and c) an insulating buffer layer, absent from the active faceof the component, separating the coating materialfrom this component

Multi-component device integrated into a matrix

An electronic device with integrated discrete components, including a wafer including cavities that can receive the components, an active face of the components being in a same plane as a face of the receiving wafer, and a material for laterally coating the components in the cavities.

Integrated multicomponent device in a semiconducting die

A handle wafer for microelectronic functional wafers, including at least one cavity through the thickness of the wafer, this cavity including a viewing window in solid or solidified material.

Handle wafer having viewing windows

A novel method makes it possible to form cavities intended to contain a liquid with determined optical properties within a film for optical use. The walls () of the cavities () are formed by plasma etching of a layer of transparent or light absorbent material () transferred onto a microtechnological substrate, the walls () having a structured profile in order to limit the parasitic phenomena of light diffusion and diffraction.

Production of cavities that can be filled with a fluid material in an optical microtechnological component

A method of producing an electronic connection device, including: a) formation, in a plane of a support substrate, of at least one first contact element and, in a direction approximately perpendicular to the plane, of at least one second contact element having a first end in electrical contact with the first contact element or elements and a second end, the second contact element or elements including one or more metal tracks standing up along the direction perpendicular to the surface of the substrate; b) then positioning at least one electrical or electronic component in contact with the first contact element or elements; and c) encapsulation of the component(s) and of the first and second contact elements, at least the second end or ends of the second contact element or elements being flush with the surface of the encapsulating material.

Method of producing a via in a reconstituted substrate

A reconstituted electronic device including: a first face and a second face; a plurality of individual chips placed perpendicular to the faces, each individual chip carrying, on one of its surfaces, at least one component, tracks, and a connection mechanism that are flush with one or other of the faces of the reconstituted electronic device; and an encapsulant that encapsulates the individual chips.

3D integration of vertical components in reconstituted substrates

A method for installing a sorption element in a cavity including: disposing, within the cavity, a getter material, a reaction material, and a protective material, the protective material covering at least one part of the getter material so as to bury the at least one part; raising a temperature up to at least one removal temperature; and moving the protective material towards the reaction material by reaction between the protective material and the reaction material so that at least one portion of the part of the getter material is no longer covered with the protective material.

Thin film getter protection

A device including: a first layer of material; a second layer of material disposed as a sealing layer; walls disposed to interconnect the first layer and second layer, wherein cavities are formed by the first layer, the second layer, and the walls; a fluid at least partially filling the cavities; and blocks integrally connected to the first layer of material, and defining housings filled at least partially with the material of the second layer and not including any of the fluid.

Production of cavities filled with a fluid material in an optical microtechnological compound

Optical arrangement comprising two parallel plates each with a through-hole forming an optical input/output with a given optical axis and one at least partly optical component placed between the plates, the component and the first plate comprising first fastening studs placed transversely in opposite relationship of the plate and connected by first bumps made of a meltable material that when molten is able to selectively wet these first fastening studs in order to optically align the component and the input/output on the first plate, and the two plates comprising second fastening studs placed transversely in opposite relationship of the plate and connected by second bumps made of a meltable material that when molten is able to selectively wet the second fastening studs in order to optically align the inputs/outputs of the two plates.

Growing community of inventors

Saint Egreve, France

Jean-Charles Souriau