Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Commissariat a L'energie Atomique

Pole Europeen De Plasturgie

Jean Brun

Pierre Perichon

Sami Oukassi

Dominique Vicard

Bruno Mourey

Stéphane Caplet

Christiane Puget

Sophie Verrun

Régis Taillefer

Benoît Lepine

Xavier Baillin

Sébastien Martinet

Jean-Charles Souriau

Messaoud Bedjaoui

Jean-Sébastien Danel

Raphaël Salot

David Henry

Jean-Philippe Colonna

Emmanuel Arene

Alain Soubie

Johnny Amiran

Thierry Enot

Gerard Ruzie

Gilles Poupon

Patricia Touret

Mathilde Cartier

Remi Franiatte

Pierre Renard

Delphine Christophe

Lionel Tenchine

Abdelhak Hassaine

Jean-Marie Quemper

Laurent Lancon

Catherine Durand

Pierre Descours

Julie Haguet

David Sionneau

Franz Berger

Sealing cell for encapsulating a microelectronic component arranged on a substrate, with a cap, said sealing cell including: a bottom including a receiving zone for the substrate and a peripheral zone surrounding the receiving zone, a side wall formed of an internal face, an external face and an upper face, the upper face being configured to support the cap facing the receiving zone, an opening, arranged in the bottom of the cell, in the side wall, or in the cap, the opening being configured to be connected to a pumping system, in such a way as to be able to place under controlled atmosphere a cavity delimited by the side wall, the bottom and the cap.

Sealing cell and method for encapsulating a microelectronic component with such a sealing cell

The assembly has a central block that includes a first main face, a second main face and side faces. The second main face is opposite to the first main face, and the side faces connect the first main face to the second main face. The assembly also includes a first cover arranged on the first main face. The first main face and a first external surface of the first cover form a first groove for housing a first wire element, and the first groove extends along an entire length of the first main face. The assembly further includes a second cover arranged on the second main face. The second main face and a second external surface of the second cover form a second groove for housing a second wire element, and the second groove extends along an entire length of the second main face.

Assembly for housing wire elements

A fabrication method of a sheathed yarn includes the following steps: making a core run axially through a sheathing area; winding a sheathing fibre around the core in the sheathing area; and presenting a microelectronic chip fixed onto the core in the sheathing area. A polymer material is present between the microelectronic chip and the core when the sheathing step is performed. The polymer material creeps during the sheathing step to form a protective coating.

Incorporation of chip elements in a core yarn

The method for assembling a microelectronic chip device () in a fabric () comprises the following steps: providing a microelectronic chip device () comprising a base () and a protruding element () rising from a face of the base (), said protruding element () comprising a free end opposite the base (); inserting into the fabric () the chip device () by the free end of the protruding element; deforming the protruding element () at its free end so as to ensure the securing of the chip device () with the fabric () by forming a crimping bead ().

Method for assembling a microelectronic chip device in a fabric, chip device, and fabric incorporating a crimped chip device

Method for assembling includes: providing a system to transfer wire element from wire element supply device to wire element storage device; stretching wire element between supply and storage devices by tensioning; providing an individualized reservoir and separated chip elements, each including a connection terminal including a top with free access facing in which chip element is not present; transporting the chip element from reservoir to an assembly area between supply and storage devices in which wire element is tightly stretched in assembly area; fixing electrically conducting wire element to chip element connection terminal in assembly area; and adding electrically insulating material on chip element after latter has been fixed to wire element forming a cover, the addition of material being performed on surface of chip element including connection terminal fixed to wire element to cover at least the connection terminal and portion of wire element at fixing point of latter.

Method for assembling a microelectronic chip element on a wire element, and installation enabling assembly to be performed

The cap () is intended to be assembled with at least one chipped element (), said cap comprising a stack of a plurality of electrically insulating layers () delimiting at least one shoulder () forming a part of a first groove () for housing a wired element (). The cap further comprises: at least one electrical bump contact () arranged at an assembly surface () of the stack intended to be mounted on a face of the chipped element (); at least one electrical connection terminal (') arranged at a wall of the shoulder (); an electrical link element (), electrically linking said electrical connection terminal () to the electrical bump contact ().

Cap for a chip device having a groove, device provided with said cap, assembly consisting of the device and a wire element, and manufacturing method thereof

This process for manufacturing an electrically conductive member for an electronic component comprises the following steps: providing a structure comprising at least one blind hole having a bottom and at least one internal lateral flank connected to said bottom via a base of said lateral flank; forming the member, this forming step comprising a step of growing an electrically conductive material in order to form at least one portion of the member in the blind hole, said growth being faster at the base of the lateral flank of the blind hole than on the rest of said lateral flank, said member when formed comprising a cavity arranged at that end of said member which is located opposite the bottom of the blind hole, said cavity being entirely or partially bordered by a rim.

Process for manufacturing an electrically conductive member for an electronic component comprising an end equipped with a cavity

A substrate provided with an electrically conducting wire coated with an electrically insulating material is impregnated with a polymerizable material. A reception area for a chip is formed on a surface of the substrate by means of deformation. The housing area is stiffened using the polymerizable material. The chip is disposed in the reception area and an electrical connection area of the chip is connected electrically to the electrically conducting wire of the substrate.

Method for assembling a chip in a flexible substrate

The photovoltaic cell has a block that includes at least one semiconductor substrate in which is formed at least one photovoltaic junction that is connected to a first electrical contact element of a first pole and to a second electrical contact element of a second pole. The cell includes a first transparent cover that is placed on a first surface of the block and defines with the block of the cell a first recess groove of a first electrically conductive wire element.

Photovoltaic cell, method for assembling plurality of cells and assembly of a plurality of photovoltaic cells

A method for assembling a device on two substantially parallel taut threads. The device includes an electronic chip and two substantially parallel grooves open on opposite sides of the device. The distance separating the grooves corresponds to the distance separating the threads. The device presents a penetrating shape along an axis perpendicular to the plane of the grooves, having a base at the level of the grooves and an apex of smaller size than the distance separating the threads. The method includes the steps consisting in placing the apex of the device between the two threads; in moving the device between the two threads resulting in the threads being separated from one another by the penetrating shape of the device; and in continuing movement of the device until the threads penetrate into the grooves reverting to their initial separation distance.

Method for assembling at least one chip using a fabric, and fabric including a chip device

This invention relates to a stacked electronic device composed of stacked electronic components () distributed on one or several added-on levels (N, N) each added on the preceding level starting from a base level (N) possibly containing at least one electronic component (). At least one electrolytic connection pad of a first type () on an add-on level (N) directly connects a conducting element (c) placed on one face of an electronic component () on an add-on level (N) to a conducting element (z) placed on an opposite face of a neighboring level (N) while at least one electrolytic connection pad of a second type () on the add-on level (N) passes through a coating layer () coating the sides of the electronic component () on the add-on level (N) and directly electrically connects two conducting elements (z, z) located on each side of said coating layer ().

Stacked electronic device and method of making such an electronic device

A method for forming a sheathed wire includes the steps of: axially advancing a core through a sheathing zone; wrapping a sheathing fiber around the core in the sheathing zone; and providing, in the sheathing zone, a series of microelectronic chip elements each provided with a wire section, in such a way that the sheathing fiber that wraps around the core also wraps around a chip element and the wire section thereof to form a sheathed wire incorporating spaced-apart chip elements.

Inclusion of chip elements in a sheathed wire

An apparatus for assembling chip devices on a wire, each chip device comprising two substantially parallel lateral walls, and a groove in one of the lateral walls for receiving said wire. The apparatus includes a pinching device having two opposing surfaces, the distance between the opposing surfaces being substantially constant and substantially equal to the distance between the two lateral walls of a chip device. A wire feeder is adapted to continuously feed the wire in contact with one of the opposing surfaces of the pinching device. A chip device feeder is adapted to drive chip devices, one at a time, between the opposing surfaces, with their grooves turned towards the wire. The pinching device may comprise two cylindrical rollers having rotation axes substantially perpendicular to the wire, the opposing surfaces being formed by respective surfaces of the rollers.

Apparatus for assembling chip devices on wires

The assembly comprises at least one microelectronic chip having two parallel main surfaces and lateral surfaces, at least one of the lateral faces comprising a longitudinal groove housing a wire element having an axis parallel to the longitudinal axis of the groove. The groove is delineated by at least two side walls. The wire element is secured to the chip at the level of a clamping area between at least one bump arranged on one of the side walls, and the side wall of the groove opposite said bump. The clamping area has a smaller height than the diameter of the wire element and a free area is arranged laterally to the bump along the longitudinal axis of the groove. The free area has a height, corresponding to the distance separating the two side walls, that is greater than the diameter of the wire element.

Assembly of a wire element with a microelectronic chip with a groove comprising at least one bump securing the wire element

A first step of the method for assembling a wire element with an electronic chip comprises arranging the wire element in a groove of the chip delineated by a first element and a second element, joined by a link element comprising a plastically deformable material, and a second step then comprises clamping the first and second elements to deform the link element until the wire element is secured in the groove.

Method for assembling at least one chip with a wire element, electronic chip with a deformable link element, fabrication method of a plurality of chips, and assembly of at least one chip with a wire element

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Champagnier, France

Jean Brun