Samsung Electronics Co., Ltd.

Korea University Industrial Academic Collaboration Foundation

Jea-shik Shin

In-sang Song

Yun-kwon Park

Byeoung-ju Ha

Byeong-kwon Ju

Jae-Sung Rieh

Young-Min Park

Jin-Woo Lee

Sang-Wook Kwon

Young-tack Hong

Seok-chul Yun

Sung-woo Hwang

Hee-Tae Kim

Eun-seok Park

Kuang-Woo Nam

Yong-Kyu Kim

Seok-mo Chang

Yun-Kwon Park

A resonator fabrication method is provided. A method includes providing a plurality of electrode patterns disposed apart from each other on a substrate using a nano-imprint technique; and forming an extended electrode pattern connected to a plurality of electrode patterns, and forming a nano structure laid across an extended electrode patterns. Therefore, a nano-electromechanical system (NEMS) resonator is easily fabricated at a nanometer level.

Resonator and fabrication method thereof

An apparatus for wireless power transmission is disclosed. According to an exemplary aspect, the wireless power transmission apparatus includes a high Q low frequency near magnetic field resonator having characteristics of a metamaterial. Accordingly, manufacturing of a compact power supply capable of wirelessly supplying power to mobile communication terminals or multimedia terminals is possible. By using a zeroth-order resonator with a DNG or ENG structure, a small-sized power supply with a simple configuration may be manufactured.

Apparatus for wireless power transmission using high Q low frequency near magnetic field resonator

A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.

Balance filter packaging chip having balun mounted therein and manufacturing method thereof

A resonant structure is provided, including a first terminal, a second terminal which faces the first terminal, a wire unit which connects the first terminal and the second terminal, a third terminal which is spaced apart at a certain distance from the wire unit and which resonates the wire unit, and a potential barrier unit which is formed on the wire unit and which provides a negative resistance component. Accordingly, transduction efficiency can be enhanced.

Resonant structure comprising wire and resonant tunneling transistor

Growing community of inventors

Hwaseong-si, South Korea

Jea-shik Shin