Samsung Electro-mechanics Co., Ltd.

Jea Hoon Lee

Yeo Ju Cho

Young Ghyu Ahn

Jae Yeol Choi

Sang Huk Kim

Dae Bok Oh

Hye Jin Kim

Wi Heon Kim

Chang Hee Lee

Jong Young Kim

Jae Hoon Kim

Gyoung Heon Ko

Young Jong Yoo

Ji Su Song

An electronic component includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, respectively disposed on external surfaces of the capacitor body in a first direction; and an interposer disposed below the multilayer capacitor and including an interposer body, a pair of via holes penetrating through the interposer body, and a pair of via electrodes, respectively disposed in the via holes to be connected to the pair of external electrodes, respectively. 0.24T≤t≤0.3T, where 'T' is a maximum height of the multilayer capacitor and “t” is a maximum height of the interposer.

Electronic component and board for mounting the same

A coil component includes a body including a first surface and a second surface opposing each other, and a first side surface and a second side surface opposing each other and connecting the first surface of the body to the second surface of the body; a support substrate embedded in the body and including a first surface and a second surface opposing each other; coil portion disposed on the support substrate; and a recognition pattern disposed on the first surface of the body, wherein the recognition pattern extends, from an edge region in which the first surface of the body is in contact with the first side surface of the body, toward an edge region in which the first surface of the body is in contact with the second side surface of the body.

Coil component

A multilayer electronic component has a structure in which an internal electrode connected to a positive (+) terminal of a circuit and an internal electrode connected to a ground of the circuit are implemented together on one dielectric layer and external electrodes commonly use a multi-terminal connected to the ground of the circuit.

Multilayer electronic component

There is provided a composite electronic component including a composite body having a capacitor and an inductor coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes facing each other with the dielectric layers interposed therebetween are stacked, and the inductor including a magnetic body including a coil part; a first input terminal; an output terminal; and a ground terminal.

Composite electronic component and board having the same mounted thereon

There are provided a multilayer ceramic electronic component and a board for mounting the same. The multilayer ceramic electronic component includes a hexahedral ceramic body including dielectric layers and satisfying T/W&#x3e;1.0 when a width thereof is defined as W and a thickness thereof is defined as T; an active layer in which capacitance is formed, by including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, having the dielectric layer interposed therebetween, an upper cover layer formed above the active layer; a lower cover layer formed below the active layer and having a greater thickness than the upper cover layer; and first and second external electrodes covering the end surfaces of the ceramic body, wherein when a thickness of the lower cover layer is defined as Tb, 0.03&#x2266;Tb/T&#x2266;0.25 is satisfied.

Multilayer ceramic electronic component and board for mounting the same

Growing community of inventors

Gyunggi-do, South Korea

Jea Hoon Lee