United Microelectronics Corp.

Je-Yi Su

Ping-Chia Shih

Chi-Cheng Huang

Hsiang-Chen Lee

Yu-Chun Chang

Wan-Fang Chung

A method for fabricating semiconductor device is disclosed. Preferably, two hard masks are utilized to define the width of the first gate (may serve for a control gate) and the width of the second gate (may serve for a select gate). The widths are thus well controlled. For example, in an embodiment, the width of the select gate may be adjusted in advance as desired, and the select gate is protected by the second hard mask during an etch process, so as to obtain a select gate which upper portion has an appropriate width. Accordingly the semiconductor device would still have an excellent performance upon miniaturization.

Method for fabricating semiconductor device

A semiconductor device including a first gate structure and a second gate structure immediately adjacent to each other with a spacer therebetween. Line width of the top of the second gate structure is not less than that of the bottom thereof. A fabrication method thereof is also disclosed. A transient first gate structure and a temporary gate structure are formed by etching through a first hard mask. A second gate structure is formed between a first spacer and a second spacer opposite to each other and disposed respectively on the transient first gate structure and temporary gate structure. The second gate structure is covered with a second hard mask. An etch process is performed through a patterned photoresist layer to remove exposed first hard mask and temporary gate structure and to partially remove exposed portion of first hard mask and transient first gate structure to form the first gate structure.

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Tainan, Taiwan

Je-Yi Su