Samsung Electronics Co., Ltd.

Je Suk Lee

Yun Tae Lee

Jae Yong Park

Su-Young Lee

Deok Ha Shin

Jun-Woo Park

Joon Seo Yim

So Young Jeong

Hee Geun Park

Jang Ho Moon

Il Yun Jeong

An image sensing system includes a camera module and an application processor. The camera module includes: an image sensor including a pixel array, the pixel array including color filters having a first pattern, the image sensor being configured to sense light incident on the pixel array to generate a first pattern image signal having the first pattern; a first converter configured to convert the first pattern image signal into a second pattern image signal having a second pattern different from the first pattern; and a second converter configured to convert the second pattern image signal into a third pattern image signal having a third pattern different from the first pattern and the second pattern. The application processor is configured to perform image processing on the third pattern image signal.

Image sensing system for converting an image signal to have a specific pattern

An image sensor may include a pixel array having an N&#xd7;M array of merged pixels arranged in a Bayer pattern, each merged pixel including an k*l matrix of unit pixels of a same color, where k and l are integers greater than two; and an image signal processor to process signals output by the pixel array in accordance with a normal mode or a zoom-in mode. In the zoom-in mode, signals from the pixel array may be remosaiced such that signals corresponding to the unit pixels are arranged in a p*q matrix of unit pixels of a same color, wherein p is a non-negative integer that is less than k and q is a non-negative integer less than 1, the p*q matrixes being arranged in a Bayer pattern.

Image sensor and electronic device including the image sensor, and method of image zoom processing

An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.

Image sensor modules, methods of manufacturing the same, and image processing systems including the image sensor modules

Growing community of inventors

Suwon-si, South Korea

Je Suk Lee