Samsung Electronics Co., Ltd.

Je Min Ryu

Reum Oh

Jihye Kim

Byongmo Moon

Beomyong Kil

Sungoh Ahn

Moonhee Oh

SeungHan Woo

BumSuk Lee

Jaeyoun Youn

Hak-Soo Yu

A method for using a high bandwidth memory controller includes providing a clock signal having a first clock frequency, providing a write strobe signal having a second clock frequency, providing a write command/address signal based on the clock signal, and providing a write data signal based on the write strobe signal. The first clock frequency is half of the second clock frequency, the write strobe signal has two cycles of pre-amble before the write data signal, and the write strobe signal has two cycles of post-amble after the write data signal.

Memory device transmitting and receiving data at high speed and low power

A memory device includes a control logic circuit, a write data strobe signal divider, a data transceiver, and a memory cell array. The control logic circuit generates a reset signal before a write data strobe signal provided from a memory controller starts to toggle. The write data strobe signal divider generates internal write data strobe signals that toggle depending on toggling of the write data strobe signal, the internal write data strobe signals toggling with different phases, respectively. The control logic circuit initializes the internal write data strobe signals to given values in response to the reset signal. The data transceiver receives write data provided from the memory controller based on the internal write data strobe signals. The memory cell array stores the received write data.

A semiconductor die may include a first delay circuit formed on a substrate and configured to delay a test signal, the first delay circuit including first delay stages connected in series, a second delay circuit formed on the substrate and configured to delay the test signal, the second delay circuit including second delay stages connected in series, at least one through silicon via connected to at least one output terminal of output terminals of the first delay stages, the at least one through silicon via penetrating through the substrate, and a load determinator configured to compare a first delay signal output from one of the first delay stages with a second delay signal output from one of the second delay stages and determine a load of the at least one through silicon via.

Semiconductor die for determining load of through silicon via and semiconductor device including the same

A memory device includes a command decoder and a status circuit. The command decoder decodes a command. The status circuit sequentially stores operation information of the memory device determined based on the decoded command and outputs at least one of the sequentially stored operation information in response to an output control signal.

Memory device comprising status circuit and operating method thereof

An operation method of a semiconductor memory device including a memory cell array and an internal processor configured to perform an internal processing operation includes receiving at the memory device a first mode indicator that indicates whether the memory device should operate in a processor mode or in a normal mode, receiving at the memory device processing information for the memory device, when the first mode indicator indicates that the memory device should operate in the processor mode, storing the processing information in a first memory cell region of the memory cell array, using the stored processing information to perform internal processing by the internal processor, and storing a result of the internal processing in the memory cell array.

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Seoul, South Korea

Je Min Ryu