Nvidia Corporation

Jayprakash Chipalkatti

Zuhair Bokharey

Brian Schieck

Don Templeton

Julie Lam

Prashant Pathak

Abraham Fong Yee

Shantanu Kalchuri

An IC package including an integrated circuit die having a major surface and one or more solder bumps located on the major surface in at least one corner region of the major surface and a substrate having a surface, the surface including bump pads thereon. The major surface of the integrated circuit die faces the substrate surface, the one or more solder bumps are bonded to individual ones of the bump pads to thereby form a bond joint, the major surface of the integrated circuit die has a footprint area of at least about 400 mm. A ratio of a coefficient of thermal expansion of the substrate (CTE) to a coefficient of thermal expansion of the integrated circuit die (CTE) is at least about 3:1. A method of manufacturing an IC package is also disclosed.

IC package design and methodology to compensate for die-substrate CTE mismatch at reflow temperatures

Embodiments of the invention provides an IC system in which low-power chips can be positioned vertically proximate high-power chips without suffering the effects of overheating. In one embodiment, the IC system includes a first substrate, a high-power chip disposed on a first side of the first substrate, a thermal conductive pad disposed on a second side of the first substrate, one or more thermal conductive features formed in the first substrate, wherein the thermal conductive features thermally connect the high-power chip and the thermal conductive pad, and a heat sink attached to a surface of the thermal conductive pad, wherein the heat sink is in thermal communication with the thermal conductive pad. By having thermal conductive features formed through the first substrate to thermally connect the high-power chip and the thermal conductive pad, heat generated by the high-power chip can be effectively dissipated into the heat sink.

Thermal performance of logic chip in a package-on-package structure

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Santa Clara, CA, United States of America

Jayprakash Chipalkatti