National Starch and Chemical Investment Holding Corporation

Other

Henkel Ag & Company, Kgaa

Henkel IP Holding Gmbh

Jayesh P Shah

Quinn K Tong

Krunal Trivedi

Paul L Morganelli

Nishant Tale

David Peard

Brian Wheelock

Aine Mooney

Nippon Ghosh

Anthony DeBarros

Dipak Tathe

Kedar Deshmukh

Douglas Katze

Sangita Singh

Two-part cyanoacrylate/cationically curable adhesive systems are provided.

Two-part cyanoacrylate curable adhesive system

The present invention describes a mouse tail vessel injection device. The device consists of a ring situated on top of a platform, which is attached to a tourniquet, and includes a tool to place the device on and off the tail of the mouse. The ring allows access to the lumen of the tail vessel by providing the appropriate angle and width for the needle gauge. The placement tool contains 3 adjustable prongs which insert into the retainer holes attached to the tourniquet, thus allowing expansion and contraction of the tourniquet to move the device on and off the tail.

Animal injection clip

A wrist mounted toy is described wherein a pressurized canister containing a string foam compound, or other pressurizable liquid with mid to low viscosity, is attached to a vessel containing a check valve. A geared-trigger mechanism allows for the user to expel the fluid at a pressure and rate dependent on the pressure he or she places on the lever. Additionally, the actions of removing and replacing the air and fluid canisters provide the user with a more interactive experience compared to a simple load and shoot toy. Many variations can be adapted to the toy to allow for a wide range of uses. The toy allows the user to enjoy a device which resembles the Marvel character's shooter more closely and discharge the fluid to quite a distance.

Wrist-mounted pressurized fluid shooter

A wear resistant substrate including a metal substrate having a surface, a reinforcing support attached to the surface and cured reaction products of an inorganic curable composition disposed over and through the reinforcing support and bonded to the surface. Also a method of enhancing the wear resistance of a metal surface by attaching a reinforcing support to the surface; disposing an inorganic curable composition over and through the reinforcing support and into contact with the surface; and curing the composition.

Method of coating and protecting coal tip burner with colloidal silica based high temperature and abrasion resistant putty

A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride, a core shell polymer and a catalyst. In an alternative embodiment, the composition also contains a linear anhydride. Various additives, such as surfactants and coupling agents may also be added to the composition.

Toughened epoxy-anhydride no-flow underfill encapsulant

The invention relates to a method for utilizing one or more B-stageable or pre-formed underfill encapsulant compositions in the application of electronic components, most commonly chip scale packages (CSP's) to substrates. One such composition comprises a thermoplastic resin system comprising a phenoxy resin, an expandable polymer sphere or thermosetting composition, optionally an epoxy resin such as higher molecular weight epoxy resin, a solvent, an imidazole-anhydride catalyst or comparable latent catalyst, and optionally, fluxing agents and/or wetting agents. The underfill encapsulant may be B-stageable to provide a coating on the substrate or component that is smooth and non-tacky. In an alternative embodiment, the underfill encapsulant is a pre-formed film. In both embodiments the expandable filler material expands upon the application of higher temperatures to form a closed-cell foam structure in the desired portion of the assembly. The method of applying the underfill application of the underfill to a component or substrate, attachment of the component and substrate, and heating of the assembly to a temperature sufficient to cause the expandable thermoplastic or thermosetting composition to foam. A second pre-applied underfill composition containing an epoxy resin, an anhydride curing agent, and catalyst may also be applied, either separately or in conjunction with the foamable underfill. The second composition acts as a pressure sensitive adhesive and may be applied selectively to parts of the CSP, for example to the solder bumps. The pressure sensitive adhesive property of the composition provides sufficient tack in order to hold the electronic assembly together during the assembly process.

Method of using pre-applied underfill encapsulant

The present invention relates to a pressure sensitive fluxing underfill composition that may be pre-applied to electronic components, such as CSP's, in order to increase the reliability of the component against mechanical stresses such as impact and bending. The composition contains an epoxy resin, a solid anhydride curing agent, and catalyst. Other materials, such as air release agents and fillers, may also be added as desired. The composition may be applied selectively to parts of the CSP, for example to the solder bumps. The composition provides sufficient tack in order to hold the electronic assembly together during the assembly process.

Pre-applied fluxing underfill composition having pressure sensitive adhesive properties

A method for utilizing one or more pre-formed underfill compositions in the application of surface mount components, most commonly chip scale packages (CSP's), to substrates for use in electronic devices. The pre-formed underfill of the invention is applied directly to the top and/or sides of the CSP before the reflow process and softens during reflow to flow across the circuit/board gap. One underfill composition utilized for this method comprises a thermoplastic film system that provides a coating on the component that is smooth and non-tacky. The film may be applied selectively to parts of the CSP such that it overhangs the top of the component and upon reflow flows over the edge of the CSP to form a connection with the substrate. A second pre-applied underfill composition or solder paste may be applied as an adhesive to provide sufficient tack in order to hold the electronic assembly together during the assembly process and to serve as a flux to facilitate solder wetting.

Method for pre-applied thermoplastic reinforcement of electronic components

A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride and a catalyst. In an alternative embodiment, the composition also contains a linear anhydride. Various additives, such as surfactants and coupling agents may also be added to the composition.

Growing community of inventors

Plaistow, NH, United States of America

Jayesh P Shah