General Electric Company

Jay Todd Labhart

Graham Charles Kirk

Hendrik Pieter Jacobus De Bock

Shakti Singh Chauhan

Joo Han Kim

Tao Deng

Stanton Earl Weaver, Jr

Yogen Vishwas Utturkar

Binoy Milan Shah

Pramod Chamarthy

Brian Patrick Hoden

Stuart Connolly

Pramod Charmarthy

Stanton Earl Weaver Jr

A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.

Reusable phase-change thermal interface structures

A thermal interface device having a containment structure and a thermal conductor is provided. Further, the containment structure includes at least one wall, where the containment structure is configured to facilitate passage of heat. Furthermore, the thermal interface device includes a thermal conductor disposed at least in a portion of the containment structure. Moreover, the thermal conductor is configured to reversibly switch between a solid state and a liquid state. Also, the thermal interface device is a re-workable device.

Thermal interface devices

An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.

Electronics chassis and method of fabricating the same

A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame. The circuit card assembly also includes a heat transfer device coupled to the frame. The heat transfer device has a heat pipe disposed at least in part between the frame and the printed circuit board. The circuit card assembly further includes a pivotable brace biasing the heat pipe toward the electronic component to facilitate cooling the electronic component.

Circuit card assembly and method of fabricating the same

Growing community of inventors

Cary, NC, United States of America

Jay Todd Labhart