Apple Inc.

Other

Jay S Nigen

Brett W Degner

Matthew Phillip Casebolt

Frank Faqiu Liang

Ron Alan Hopkinson

Bartley K Andre

Richard H Tan

Christiaan A Ligtenberg

Jeremy D Bataillou

Charles A Schwalbach

William Francis Leggett

Jesse T Dybenko

Eric R Prather

Eric J Weirshauser

David H Narajowski

Nicholas Alan Rundle

Eugene Antony Whang

Christopher J Stringer

Mikael M Silvanto

Joshua D Banko

Kevin Scott Fetterman

Jonathan L Berk

Caitlin Elizabeth Kalinowski

Douglas Lea Heirich

Gavin J Reid

Eric Andrew Knopf

Connor Raymond Duke

Nicholas Mancini

Houtan R Farahani

Anthony Joseph Aiello

Afrooz Family

Michael D Hillman

Daniel R Borges

Matthew Theobald

Gregory L Tice

James Hollabaugh

Brandon S Smith

Richard Lidio Blanco

Arash Naghib Lahouti

Daniel S Naito

Phillip Lee Mort

Chad C Schmidt

Keith Alan Cox

Ihab A Ali

Richard D Kosoglow

James S Ismail

Kristopher P Laurent

Derek Yap

Amaury J Heresztyn

Nagarajan Kalyanasundaram

Laura M Campo

Trevor J Edmonds

Connor R Duke

Electronic device

An assembly for heat-generating components includes a metal and a non-metal layer. To secure to a circuit board that carries a heat-generating component, a metal standoff is secured on a perimeter of the circuit board. Multiple protruding elements of the metal layer of the assembly secure within a respective opening of the standoff. The assembly secures, through metal-to-metal contact, to the standoff by multiple mechanical couplings. The assembly not only covers the circuit board, but also extends laterally beyond the circuit board (and the circuit board components). As a result, the assembly receives thermal energy from a heat-generating component(s) on the circuit board and allows the thermal energy to flow through assembly from one portion of the assembly covering the heat-generating component(s) to the lateral portion of the assembly that does not cover the heat-generating component(s).

Thermal module for a circuit board

This application relates to a layout of components within an electronic device. The electronic device includes a circuit board and one or more thermal components located on or proximate to each surface of the circuit board. As a result, thermal energy generated by components of the circuit board are drawn away from the circuit board in a more efficient manner. Additionally, the electronic device may include one or more air movers designed to draw ambient air into the electronic device in a manner that causes the ambient air to cool components upstream from the air movers. Further, the electronic device includes a fin stack that is thermally coupled to the aforementioned thermal components, and further receives air driven in by the air mover(s). Also, the electronic device is designed to receive the ambient air through openings that define a 360-degree air inlet.

Internal architecture of a computing device

The disclosed embodiments related to a component for use in a portable electronic device. The component includes a wall of the portable electronic device, containing an intake zone that includes a set of intake vents. The wall also includes an exhaust zone containing a set of exhaust vents.

Optimized vent walls in electronic devices

The described embodiments relate to improving efficiency of a low-profile cooling fan. In one embodiment, an impeller of the cooling fan includes a shroud which covers a central portion of the impeller, thereby allowing a central inlet portion of the blades to have an increased fan blade height when compared to a cooling fan constrained by minimum part tolerances between the fan blades and a portion of the fan housing. In some embodiments, the impeller includes splitter blades that can improve performance of the low-profile cooling fan.

Shrouded fan impeller with reduced cover overlap

Systems and methods are disclosed for determining a current machine state of a processing device, predicting a future processing task to be performed by the processing device at a future time, and predicting a list of intervening processing tasks to be performed by a first time (e.g. a current time) and the start of the future processing task. The future processing task has an associated initial state. A feed-forward thermal prediction model determines a predicted future machine state at the time for starting the future processing task. Heat mitigation processes can be applied in advance of the starting of the future processing task, to meet the future initial machine state for starting the future processing task.

Predictive control systems and methods

A method for operating a distributed wireless audio system including several loudspeaker cabinets all of which can communicate with each other as part of a computer network. The method receives temperature data that is indicative of temperature of a first loudspeaker cabinet, which has a network master responsibility of obtaining an audio signal from an audio source and wirelessly transmitting some of the audio signal to a second loudspeaker cabinet of several loudspeaker cabinets, for playback by the second loudspeaker cabinet, while playing back some of the audio signal by the first loudspeaker cabinet. The method determines whether a thermal threshold of the first loudspeaker cabinet has been reached, based on the temperature data. The method, in response to the thermal threshold being reached, gives up the network master responsibility from the first loudspeaker cabinet to the second loudspeaker cabinet, where doing so reduces temperature in the first loudspeaker cabinet.

Dynamic master assignment in distributed wireless audio system for thermal and power mitigation

The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.

Gaskets for thermal ducting around heat pipes

The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.

Computer thermal system

The disclosed embodiments related to a component for use in a portable electronic device. The component includes a wall of the portable electronic device, containing an intake zone that includes a set of intake vents directed at a first angle toward one or more heat-generating components of the portable electronic device. The wall also includes an exhaust zone containing a set of exhaust vents directed at a second angle out of the portable electronic device.

An electronic device such as a portable computer may be provided with a lower housing and an upper housing. The electronic device may include hinge structures which allow the upper housing to rotate about a rotational axis relative to the lower housing. The electronic device may include a ventilation port structure with intake openings that allow air to be drawn into the electronic device. The ventilation structure may also include exhaust openings that are used to expel air from the lower housing. When the electronic device is in an open position, it may be desirable for the ventilation structure to form more exhaust openings than when the electronic device is in a closed position. The ventilation structure may form lower exhaust openings when the electronic device is in the closed position and form upper and lower exhaust openings when the electronic device is in the open position.

Electronic devices with ventilation systems

Growing community of inventors

Mountain View, CA, United States of America

Jay S Nigen