Applied Materials, Inc.

Jay Rohde

Dominic J Benvegnu

Andreas Norbert Wiswesser

Stacy Meyer

Jeffrey P Schmidt

Kerry F Hughes

David Datong Huo

Ramiel Oshana

A polishing head is tested in a test station having a pedestal for supporting a test wafer and a controllable pedestal actuator to move a pedestal central wafer support surface and a test wafer toward the polishing head. In another aspect of the present description, the test wafer may be positioned using a positioner having a first plurality of test wafer engagement members positioned around the pedestal central wafer support surface. In another aspect, the wafer position may have a second plurality of test wafer engagement members positioned around an outer wafer support surface disposed around the pedestal central wafer support surface and adapted to support a test wafer. The second plurality of test wafer engagement members may be distributed about a second circumference of the ring member, the second circumference having a wider diameter than the first circumference. Additional embodiments and aspects are described and claimed.

Polishing head testing with movable pedestal

A polishing layer of a polishing has a window member with a top surface positioned a predetermined distance below the polishing surface. A transparent layer can be positioned below the polishing layer and supporting the window member.

Method of making and apparatus having polishing pad with window

Polishing pad with window

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Round Rock, TX, United States of America

Jay Rohde