3M Innovative Properties Company

Jay R Lomeda

Wendy L Thompson

Jeremy M Higgins

Wayne Scott Mahoney

John Charles Clark

Eric G Larson

Timothy D Fletcher

Audrey S Forticaux

Kyle R Schwartz

Charles L Bruzzone

Ryan E Marx

Kent S Tarbutton

Scott B Charles

Brett A Beiermann

Benjamin J Anderson

Jeffrey A Tostenrude

Gezahegn D Damte

Armin Kayser

Amit J Patel

Ethan R Rosenberg

An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods

A wireless communication system including an electrically conductive passive medium capable of simultaneously propagating therealong electromagnetic first and second currents at different respective frequencies F1 and F2, the electrically conductive passive medium including an electrically conductive first passive linear medium portion adjacent an electrically conductive first passive nonlinear medium portion, the first passive nonlinear medium portion capable of generating an intermodulation current based on a nonlinear interaction between the first and second currents, the intermodulation current having a frequency Fi equal to nF1+mF2 and propagating along the first passive nonlinear medium portion, m and n being positive or negative integers; and a first magnetic film disposed proximate an electrically conductive external surface of the first linear medium portion, such that when the first and second currents propagate along the first passive linear medium portion toward the first passive nonlinear medium portion, the magnetic film reduces or prevents the generation of the intermodulation current in the first passive nonlinear medium portion by attenuating at least portions of the first and second currents.

Magnetic absorbers for passive intermodulation mitigation

An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

The present disclosure provides a resin blend containing a blend of a first phthalonitrile resin, a filler, and a bisphenol M diphthalonitrile ether resin. Suitable fillers include at least one of nanoparticles, microparticles, or fibers. The present disclosure also provides an article including a polymerization product of such a resin blend. The resin blends can be prepared at lower temperatures than phthalonitrile resin blends without a bisphenol M diphthalonitrile ether resin.

Bisphenol M diphthalonitrile ether resin blends including a filler, and articles

Growing community of inventors

Saint Paul, MN, United States of America

Jay R Lomeda