Electro Scientific Industries, Inc.

Jay Johnson

Yunlong Sun

Brian W Baird

Richard S Harris

Edward J Swenson

Manoj Kumar Sammi

Ho Wai Lo

David A Watt

Robert Hainsey

Doug J Garcia

Thomas Leonard Reynolds

Rupendra M Anklekar

A charge pump can be used with a bus-powered device connected to a bus. The charge pump is formed of a power connection from the bus carrying a DC power signal constrained to not exceed a given current limit and a given voltage limit, a DC-to-DC step-down voltage converter, a capacitor, and a DC-to-DC step-up voltage converter. The step-down converter has an input connected to the power connection and produces an intermediate signal having a voltage the same or less than the voltage of the power signal. The capacitor is connected to the output of the step-down converter. The step-up converter has an input connected to the output of the step-down converter and to the capacitor, and produces a final output signal having a voltage greater than the given voltage limit. The output of the step-up converter is connected to and provides DC power to the device.

Charge pump for bus-powered device

A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.

Methods of and laser systems for link processing using laser pulses with specially tailored power profiles

A method of forming a scribe line having a sharp snap line entails directing a UV laser beam along a ceramic or ceramic-like substrate such that a portion of the thickness of the substrate is removed. The UV laser beam forms a scribe line in the substrate without appreciable substrate melting so that a clearly defined snap line forms a region of high stress concentration extending into the thickness of the substrate. Consequently, multiple depthwise cracks propagate into the thickness of the substrate in the region of high stress concentration in response to a breakage force applied to either side of the scribe line to effect clean fracture of the substrate into separate circuit components. The formation of this region facilitates higher precision fracture of the substrate while maintaining the integrity of the interior structure of each component during and after application of the breakage force.

Method of forming a scribe line on a passive electronic component substrate

Digital control of frequency and/or amplitude modulation techniques of an intracavity and/or extracavity AOM () facilitate substantially full extinction of a laser beam () to prevent unwanted laser energy from impinging a workpiece (); facilitate laser pulse amplitude stability through closed-loop control of pulse-to-pulse laser energy; facilitate beam-positioning control including, but not limited to, closed-loop control for applications such as alignment error correction, beam walk rectification, or tertiary positioning; and facilitate employment of more than one transducer on an AOM () to perform any of the above-listed applications.

AOM frequency and amplitude modulation techniques for facilitating full beam extinction in laser systems

AOM modulation techniques employing an upstream Bragg adjustment device

AOM modulation techniques employing plurality of transducers to improve laser system performance

AOM modulation techniques employing transducers to modulate different axes

AOM modulation techniques for facilitating pulse-to-pulse energy stability in laser systems

AOM modulation techniques employing plurality of tilt-angled transducers to improve laser system performance

A method of forming a scribe line having a sharp snap line entails directing a UV laser beam along a ceramic substrate such that a portion of the thickness of the ceramic substrate is removed. The UV laser beam forms a scribe line in the ceramic substrate in the absence of appreciable ceramic substrate melting so that a clearly defined snap line forms a region of high stress concentration extending into the thickness of the ceramic substrate. Consequently, multiple depthwise fractures propagate into the thickness of the ceramic substrate in the region of high stress concentration in response to a breakage force applied to either side of the scribe line to effect clean breakage of the ceramic substrate into separate circuit components. The formation of this region facilitates higher precision breakage of the ceramic substrate while maintaining the integrity of the interior structure of each component during and after application of the breakage force.

Method of forming a scribe line on a ceramic substrate

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Portland, OR, United States of America

Jay Johnson