Motorola Corporation

Jay J Liu

William H Lytle

George W Hawkins

Howard M Berg

Thomas A Scharr

A semiconductor chip is flip chip bonded to a substrate having a cavity or a through hole formed therein. The cavity or through hole is preferably large enough to substantially remove the narrow gap which is formed between the portion of the substrate which does not have the cavity or through hole formed therein. This allows for use of mold processes to encapsulate and underfill the semiconductor chip and for line of sight cleaning of the semiconductor chip after bonding.

Semiconductor chip bonded to a substrate and method of making

A device having a plurality of columnar structures comprised of a solderable metal disposed on a supporting base is used to remove solder from a substrate surface. Capillary action takes place in the area between the columns, thus removing the solder from the substrate surface. The present invention may be fabricated by forming columnar structures on the supporting base through mask openings or by etching a solderable metal layer into columnar structures. A standoff may be built into the device to prevent solder residue from remaining on the substrate surface between solder pads and to allow a controllable amount of solder to be left on the substrate surface.

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Chandler, AZ, United States of America

Jay J Liu