Eastman-kodak Company

Jay B Soper

Roger S Gaborski

Robert H Philbrick

Kenneth G Corl

J Terrence Flynn

Carl W Schlack

A method for manufacturing double-sided circuit assemblies by a surface mount process includes the steps of: arranging the circuit assemblies in arrays so that two or more circuit assemblies, at least one top side up and at least one bottom side up, are provided in each array; populating one side of the circuit assemblies in a first pass of the arrays through the surface mount process; flipping each array over; and populating the other side of the circuit assemblies in a second pass of the flipped arrays through the same surface mount process with no changes in stencil, placement program, or components.

Method for manufacturing double-sided circuit assemblies

An electronic organizer is provided that incorporates an internal electronic scanner and a touch sensitive display screen to enter text and image data. The internal electronic scanner permits both machine generated text and image data to be scanned and directly entered into the electronic organizer. Hand-printed text data is also entered directly via the touch sensitive display screen using a stylus or pen. The scanned machine generated text, the scanned image data and the hand-printed text can either be preserved as an image-oriented bit map, or optical character recognition routines can be applied to the data to identify characters and convert the identified characters to computer coded text data. Data entered into the electronic organizer is arranged in a relational database format, which permits the operator to quickly and easily enter and retrieve related information between a number of different databases with a minimal amount of effort. A small document transport mechanism is provided to aid in the scanning of small size documents.

Growing community of inventors

Rochester, NY, United States of America

Jay B Soper