Jds Uniphase Corporation

Lumentum Operations LLC

Jay A Skidmore

Vincent V Wong

Richard L Duesterberg

James Yonghong Guo

Prasad Yalamanchili

Lei Xu

Kong Weng Lee

Jihua Du

Yonghong Guo

Reddy Raju

Vincent M Wong

Marc K Von Gunten

Edmund L Wolak

An-Chun Tien

Victor Rossin

Xiangdong Qiu

Pierre Doussiere

Erik Paul Zucker

Nicolas Guerin

Pezhman Monadgemi

David G Mehuys

Kuochou Tai

Matthew Glenn Peters

Michael Y Au

Richard R Craig

Raman Srinivasan

Xia Hong

Jeffrey P Zack

Nina D Morozova

Chris Hart

Huijie Xu

Yaogeng Ding

John Martinho

Lihua Wang

Donald C Hargreaves

Laura Zavala

Randolph W Hines

Hilary Clarke

Christopher L Hart

William Bardy

Gity Samadi

Yongfeng Guan

Slava Khassine

Jane Cheng

An emitter array, may comprise a first set of emitters that has a nominal optical output power at an operating voltage. The emitter array may comprise a second set of emitters that has substantially less than the nominal optical output power or no optical output power at the operating voltage. The first set of emitters and the second set of emitters may be interleaved with each other to form a two-dimensional regular pattern of emitters that emits a random pattern of light at the nominal optical output power at the operating voltage. The first set of emitters and the second set of emitters may be electrically connected in parallel.

Modified emitter array

A structured light system may include a semiconductor laser to emit light and a diffractive optical element to diffract the light such that one or more diffracted orders of the light, associated with forming a structured light pattern, are transmitted by the diffractive optical element. The diffractive optical element may be arranged such that the light is to be incident on the diffractive optical element at a substantially non-normal angle of incidence. The substantially non-normal angle of incidence may be designed to cause the diffractive optical element to transmit a zero-order beam of the light outside of a field of view associated with the diffractive optical element.

Diffractive optical element with off-axis incidence for structured light application

Diffractive optical element with off-axis incidence in a structured light application

A device may include a lead-frame including a first electrode and a second electrode, a carrier, a set of optical devices mechanically and electrically connected to the first electrode, and a set of electrical connections that electrically connects the second electrode to the set of optical devices. The lead-frame and the carrier may be mechanically connected to each other via a set of interlocking structures associated with the lead-frame and the carrier. The lead-frame and the set of optical devices may have matching coefficients of thermal expansion. The first electrode and the second electrode may be electrically isolated from each other.

Emitter-on-sub-mount device

A pump laser package may include an input fiber to send signal light on a first optical path. A first lens may be arranged on the first optical path. The pump laser package may include a source to send pump light on a second optical path. A second lens and a negative lens may be arranged on the second optical path. The first lens and the negative lens may be arranged to create a virtual image associated with the pump light. The pump laser package may include an output fiber on a third optical path. The first lens may be arranged on the third optical path. The pump laser package may include a combiner to receive the signal light on the first optical path, receive the pump light on the second optical path, and send the signal light and the pump light on the third optical path.

Fiber coupled laser source pump with wavelength division multiplexer

A chip-scale package for an edge-emitting semiconductor device and a semiconductor device assembly including such a chip-scale package are provided. The chip-scale package includes an edge-emitting semiconductor device chip, a top submount disposed on a top surface of the chip, and a bottom submount disposed on a bottom surface of the chip. The top-submount area and the bottom-submount area are each greater than the chip area and less than or equal to about 1.2 times the chip area.

Chip-scale package and semiconductor device assembly

An array of laser diode emitters is used as an illumination source for a range imaging system. The laser diode emitters are disposed on a common substrate. When one of the emitters fails, the remaining emitters emit enough light to meet the output optical power specification. The emitters can be disposed with a tight spacing. The tight spacing facilitates packaging of the entire array into a compact single package on a common heat sink.

Range imaging devices and methods

Multi-mode diode emitters are stacked in a staircase formation to provide a spatially-multiplexed output. Improved coupling efficiency is achieved by providing tilted collimated output beams that determine an effective step height of the stepped structure. Since the effective step height is dependent on the tilt angle, a variable number of emitters can be used inside packages having a same physical step height, while still attaining high coupling efficiency.

High-brightness spatial-multiplexed multi-emitter pump with tilted collimated beam

A fiber coupled semiconductor device and a method of manufacturing of such a device are disclosed. The method provides an improved stability of optical coupling during assembly of the device, whereby a higher optical power levels and higher overall efficiency of the fiber coupled device can be achieved. The improvement is achieved by attaching the optical fiber to a vertical mounting surface of a fiber mount. The platform holding the semiconductor chip and the optical fiber can be mounted onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Optionally, attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.

Light emitting semiconductor device

A high field of view, low height package and wafer-level packaging process are provided. The top surface of a first wafer has recesses defined by sidewalls, with a reflector, and a floor. The reflector is incident a horizontal light path form an edge-emitting diode on the floor, directing the light path vertically. A second optically diffusing wafer receives the vertically directed light. A vertical ring to surround each recess is wafer-level fabricated on one of the wafers. The vertical ring may have a high aspect ratio to increase light diffusion. The second wafer is connected above the first such that each vertical ring encloses its corresponding recess and such that the light vertically exits the optically diffusing media after spanning the height of the vertical ring. Diode electrical connections are provided for externally controlling the diode. Individual packages are separated by double-dicing the connected wafers between the recesses.

Structure and method for edge-emitting diode package having deflectors and diffusers

A reflector is mounted to an outer perimeter of a heat sink holding at least one edge-emitting semiconductor chip, for example a laser diode. The reflector has a shape suitable for gathering light emitted by the laser diodes and redirecting the light in an upward direction away from the heat sink. The reflector can be overmolded onto the heat sink. The reflector can operate by total internal reflection, so that no additional reflector coating step is required. Injection molding of the reflectors onto the heat sink holding the laser diodes enables mass production of powerful yet inexpensive laser light sources.

Semiconductor light source having a reflector

The present invention relates to the packaging of high power laser(s) in a surface mount technology (SMT) configuration at low-cost using wafer-scale processing. A reflective sidewall is used to redirect the output emission from edge-emitting lasers through an optical element (e.g., a diffuser, lens, etc.). A common electrical pad centered inside the package provides p-side connection to multiple laser diodes (i.e. for power scalability). Thick plating (e.g. 75 um to 125 um) with a heat and electrically conductive material, e.g. copper, on a raised bonding area of a substrate provides good heat dissipation and spreading to the substrate layer during operation. The composite CTE of the substrate layer, e.g. AlN, and the heat/electrical conductive plating, e.g. Cu, substantially matches well with the laser substrates, e.g. GaAs-based, without the requirement for an additional submount.

High power surface mount technology package for side emitting laser diode

A fiber coupled semiconductor device having an improved optical stability with respect to temperature variation is disclosed. The stability improvement is achieved by placing the platform holding the semiconductor chip and the optical fiber onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Attaching the optical fiber to a vertical mounting surface of a fiber mount, and additionally attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.

Semiconductor device assembly

The invention relates to sources of optical radiation wherein polarized radiation from first and second rows of light emitters is first collimated and combined into two combined beam using first and second rows of collimating and beam re-directing elements, respectively, and then polarization multiplexed to form a polarization-multiplexed output beam. In order to reduce the footprint, emitters of the first and second emitter rows are disposed in an interleaved, staggered arrangement, and the second row of collimating and beam re-directing elements is disposed in a space between the first emitter row and the first row of collimating and beam re-directing elements.

Beam combining light source

Growing community of inventors

San Jose, CA, United States of America

Jay A Skidmore