Advanced Semiconductor Engineering, Inc.

Universal Global Scientific Industrial Co., Ltd.

Universal Scientific Industrial (shanghai) Co., Ltd.

Universal Scientific Industrial Co., Ltd.

Jaw-Ming Ding

Wei-Hsuan Lee

Chien-Yeh Liu

Jia-Hong Mou

Sung-Mao Li

Hsin-Chin Chang

Wei-Yu Chen

Hsin Chin Chang

Yi-Hung Lin

Huang-Hua Wen

Ren-Hung Chou

Wen-Tou Chiu

Chih-Hao Chiang

Rong-Hsang Ho

A power amplifier circuit includes a current generator and a current mirror driver. The current generator has a first input connected to a first voltage supply and an output configured to generate a first current. The current generator includes a first transistor, a second transistor, a first resistor and a second resistor. The first transistor has an emitter connected to ground. The second transistor has a base connected to a base of the first transistor and an emitter connected to ground. The first resistor is connected between the first voltage supply and a collector of the first transistor. The second resistor is connected between the first voltage supply and a collector of the second transistor. The current mirror drive has a first input connected to the output of the current generator to receive the first current and an output configured to generate a second current.

Power amplifier

A semiconductor package structure includes a substrate. The substrate includes a first ground layer. The first ground layer has a body and a first tooth protruding from a side of the body. The first tooth has a first lateral side. The first lateral side of the first tooth is inclined relative to the side of the body in a top view of the first ground layer.

Semiconductor package structure

A power amplifier circuit includes a first transistor, a second transistor and a bias circuit. The first transistor has a base configured to receive a first signal. The second transistor has an emitter connecting to a collector of the first transistor and a collector configured to output a second signal. The bias circuit is coupled to the first transistor and the second transistor. The bias circuit is configured to provide a direct current (DC) voltage at the collector of the second transistor about twice a DC voltage at the collector of the first transistor. The bias circuit is configured to provide an alternating current (AC) or radio frequency (RF) voltage at the collector of the second transistor about twice an AC or RF voltage at the collector of the first transistor.

Cascode amplifier bias

The present disclosure relates to a power amplifier circuit. The power amplifier circuit includes a voltage-controlled current source and a current mirror. The voltage-controlled current source is configured to receive a first voltage and to generate a first current. The current mirror is connected to the voltage-controlled current source and to generate a second current in response to the first current. The second current continuously changes from 0 mA to about 120 mA as the first voltage continuously changes from 0 V to about 1 V.

A semiconductor package device includes: (1) a substrate having a top surface; (2) a passive component disposed on the substrate and having a top surface; (3) an active component disposed on the substrate and having a top surface; and (4) a package body disposed on the substrate, the package body including a first portion covering the active component and the passive component, and a second portion covering the passive component, wherein a top surface of the second portion of the package body is higher than a top surface of the first portion of the package body, and the first portion and the second portion of the package body include different materials.

Semiconductor package device and method of manufacturing the same

The present disclosure relates to a power amplifier circuit including a current source, a power control circuit, a current mirror and an output circuit. The current source circuit includes a first transistor and a second transistor. A source of the first transistor is connected to a drain of the second transistor and a gate of the first transistor is connected to a source with the second transistor. The power control circuit is connected to a gate of the second transistor. The current mirror circuit is connected to the gate of the first transistor and a source of the second transistor. The output circuit is connected to the current mirror circuit.

Resistorless power amplifier

The present disclosure relates to a logic control circuit including a first inverter and a voltage limiter. The first inverter is connected to a first input voltage. The first inverter includes a first transistor having a first terminal and a second terminal. The second terminal of the first transistor is connected to a ground. The voltage limiter includes a second transistor. The second transistor has a gate connected to a ground, a source connected to the first terminal of the first transistor and a drain connected to a second input voltage.

Logic control circuit

The present disclosure relates to a semiconductor device package and a manufacturing method thereof. The semiconductor device package includes a carrier, at least one electronic component, a first magnetic layer and a second magnetic layer. The carrier has a top surface on which the electronic component is disposed. The first magnetic layer is disposed on the top surface of the carrier and encapsulates the electronic component. The second magnetic layer is disposed on the first magnetic layer and covers a top surface and a lateral surface of the first magnetic layer. A permeability of the first magnetic layer is less than a permeability of the second magnetic layer.

Semiconductor device including electric and magnetic field shielding

A semiconductor package device includes a substrate, a passive component, an active component and a package body. The passive component is disposed on the substrate. The active component is disposed on the substrate. The package body is disposed on the substrate. The package body includes a first portion covering the active component and the passive component, and a second portion covering the passive component. A top surface of the second portion of the package body is higher than a top surface of the first portion of the package body.

An exemplary embodiment of the present disclosure illustrates an amplifier circuit comprising an amplifier block and a biasing block. The amplifier block is used to receive an input signal and amplify the input signal to generate an output signal. The a biasing block coupled to the amplifier block is used to provide biasing voltages to bias the amplifier block, and compensate an output gain of the amplifier block before the output gain of the amplifier block is compressed, so as to extend a P1 dB compression point of the amplifier block, wherein the biasing currents are substantially independent to temperature and/or system voltage variation.

Amplifier circuit, biasing block with output gain compensation thereof, and electronic apparatus

A low noise amplifier is disclosed. The low noise amplifier comprises a current mirror circuit, a bias circuit, a cascode amplifying circuit and a power gain compensating circuit. The current mirror circuit is used for providing a first current and third current. The bias circuit is used for receiving a first current and third current and outputting a first bias voltage and a second bias voltage according to the first current and third current. The cascode amplifying circuit respectively receives the first bias voltage and the second bias voltage, and accordingly to work at an operation bias point. The power gain compensating circuit is used for receiving a RF output signal and accordingly outputs a gain compensating signal to the current mirror circuit so as to dynamically adjust current value of the first current and third current and further to compensates power gain of the low noise amplifier in order to increase 1 dB gain compression point (P1 dB).

Low noise amplifier and receiver

A low noise amplifier is disclosed. The low noise amplifier comprises a current mirror circuit, a bias circuit, a cascode amplifying circuit and a power gain compensating circuit. The current mirror circuit is used for providing a mapping current. The bias circuit is used for receiving a mapping current and outputting a first bias voltage and a second bias voltage according to the mapping current. The cascode amplifying circuit respectively receives the first bias voltage and the second bias voltage, and accordingly to work at an operation bias point. The power gain compensating circuit is used for receiving a RF output signal and accordingly outputs a gain compensating signal to the current mirror circuit so as to dynamically adjust current value of the mapping current and further to compensates power gain of the low noise amplifier in order to increase linearity.

A radio frequency (RF) power amplifier is disclosed. The RF power amplifier includes a bias circuit, an output stage circuit and dynamic bias controlling circuit. The bias circuit receives a first system voltage and provides a working voltage accordingly. The output stage circuit receives the working voltage so as to work at an operation bias point. The dynamic bias controlling circuit detects a RF input signal and outputs a compensation voltage to the bias circuit according to variation of the RF input signal, wherein the dynamic bias controlling circuit is an open loop configuration. When an input power of the RF input signal increases and makes the working voltage decreases so as to shift the operation bias point, the bias circuit adjusts the working voltage upward so as to recover or enhance the operation bias point according to the compensation voltage received.

Electronic system&#x2014;radio frequency power amplifier and method for dynamic adjusting bias point

The RF stacked power amplifier comprises a voltage-dividing circuit, a negative feedback bias circuit, a current source circuit and a stacked amplifying circuit. The voltage-dividing circuit receives a system voltage and divides the system voltage for outputting a first reference partial voltage and a second reference partial voltage. The negative feedback bias circuit receives a negative feedback reference voltage and correspondingly outputs a second bias reference voltage according to a result of comparing the second reference partial voltage and the negative feedback reference voltage. The current source circuit determines a bias reference current according to the first reference partial voltage. The stacked amplifying circuit outputs the negative feedback reference voltage and determines an operation bias point according to a first bias reference voltage and the bias reference current. The RF stacked power amplifier makes the voltage-drop and the power consumption of each transistor equal via the voltage-dividing circuit.

RF stacked power amplifier bias method

A bandgap reference voltage generating circuit for providing a reference voltage is disclosed. The bandgap reference voltage generating circuit includes four-terminal current source circuit, a regulator circuit and a temperature-compensating circuit. The four-terminal current source circuit outputs a first voltage, a second voltage and a first current which are independent of variation of a first system voltage. The regulator circuit receives the first voltage and the second voltage and when the first system voltage is larger than a threshold voltage value, the regulator circuit outputs the reference voltage independent of variation of the first system voltage via voltage-difference between the first voltage and the second voltage. The temperature-compensating circuit receives the first current and compensates a temperature curve of the reference voltage outputted from the regulator circuit.

Growing community of inventors

Taoyuan County, Taiwan

Jaw-Ming Ding