International Business Machines Corporation

Javier V Goicochea

Thomas J Brunschwiler

Bruno Michel

Patrick Ruch

Heiko Wolf

Walter Heinrich Riess

Stephan Paredes

Chin Lee Ong

Werner Escher

Cyrill Kuemin

Ahmed S G Khalil

Stefano Sergio Oggioni

Gerd Schlottig

Adsorption heat exchanger devices () are provided for use in solid sorption refrigeration systems () together with methods for making such devices and adsorbent structures therefor. The methods include applying a curable binder, in solution in a solvent, to granular adsorbent material, and then evaporating the solvent and curing the binder. The curable binder solution is sufficiently dilute that, during evaporation of the solvent, the binder becomes concentrated around contact points between granules () of the adsorbent material whereby localized bonds () are formed around the contact points on curing of the binder.

Adsorption heat exchanger devices

Adsorption heat exchanger devices () are provided for solid sorption refrigeration systems (). Such a device includes a heat exchanger () having a plurality of projections () arranged for extending into an adsorbate of the system () in use. An adsorption structure () is formed on the heat exchanger () for adsorption of said adsorbate. The adsorption structure () comprises a plurality of elongate adsorption elements () extending outwardly from each of said projections () of the heat exchanger ().

A desalination system () for producing a distillate from a feed liquid includes: a steam raising device () having a liquid section () and a steam section () which are separated by a membrane system (); a membrane distillation device () having a first steam section () and a liquid section () which are separated by a wall () and having a second steam section () which is separated from the liquid section () by a membrane system (); and a heat exchange device () having a first liquid section () and a second liquid section (), which are separated by a wall ().

Desalination system and method for desalination

A bridging arrangement for coupling a first terminal to a second terminal includes a plurality of particles of a first type forming at least one path between the first terminal and the second terminal, wherein the particles of the first type are attached to each other; a plurality of particles of a second type arranged in a vicinity of a contact region between a first particle of the first type and a second particle of the first type, wherein at least a portion of the plurality of particles of the second type is attached to the first particle of the first type and the second particle of the first type.

Bridging arrangement and method for manufacturing a bridging arrangement

A method for manufacturing an underfill in a semiconductor chip stack having a cavity between a first surface and a second surface includes providing at least one access hole in one of the first or second surface; providing at least one vent hole in the one of the first or second surfaces; and applying a viscous filling material through the at least one access hole into the cavity thereby squeezing out air or gas through the at least one vent hole.

Manufacturing an underfill in a semiconductor chip package

A method for manufacturing a filling in a gap region between a first surface and a second surface includes applying a suspension comprising a carrier fluid and filler particles in the gap region between the first and the second surface; and withholding filler particles by a barrier element in the gap region to form a path of attached filler particles between the first surface and the second surface.

Growing community of inventors

Rueschlikon, Switzerland

Javier V Goicochea