Intel Corporation

Javier Avalos Garcia

David Shia

Jin Yang

Michael Berktold

Yuyang Xia

Adriana Lopez Iniguez

Luz Karine Sandoval Granados

Chia-Pin Chiu

Jun Zhang

Damion T Searls

Richard J Dischler

Barrett M Faneuf

Hemant D Desai

Bijoyraj Sahu

Eric W Buddrius

Mohanraj Prabhugoud

Jessica Gullbrand

Kenan Huseyin Arik

Prabhakar Subrahmanyam

Catharina Biber

Shaorong Zhou

Ying-Feng Pang

Kristin L Weldon

Yi Xia

Victor Polyanko

Andres Ramirez Macias

Carlos Alvizo Flores

Jimmy Chuang

Brendan T Pavelek

Lianchang Du

Minh T D Le

Mark Bianco

Yuehong Fan

Yuan Li

Xiaojin Gu

Xicai Jing

Yuan-Liang Li

Maria De La Luz Belmont

Oscar Farias Moguel

Shengzhen Zhang

Bergen Anderson

John Raatz

Jeffrey Ryan Conner

Samer Melhem

Aravind Munukutla

Anil Kumar Kurella

Samantha Yates

An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.

Liquid cooling system leak detection improvements

An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.

Boiling enhancement structures for immersion cooled electronic systems

A liquid cooling system is described. The liquid cooling system includes a heat sink to provide a warmed liquid. The heat sink is to receive heat generated by at least one semiconductor chip of an electronic system. The liquid cooling system includes a heat exchanger to receive the warmed liquid and to provide a cooled liquid. The liquid cooling system includes a pump. The pump is to draw the cooled liquid at the pump's input so that respective pressures of the warmed and cooled liquids' are less than atmospheric pressure.

Liquid cooling system with sub atmospheric pressure coolant

Growing community of inventors

Zapopan, Mexico

Javier Avalos Garcia