Intel Corporation

Javed Shaikh

Jeff Ku

Min Suet Lim

Je-Young Chang

Mark Charles Carbone

Prakash Kurma Raju

Juha Paavola

Vivek Paranjape

Prasanna Pichumani

Gavin Sung

Daniel J Ragland

Gustavo Fricke

Arnab Sen

Hua Yang

Weihua Tang

Justin Michael Huttula

John Lang

Kelly P Lofgreen

Aastha Uppal

Kannan G Raja

Fern Nee Tan

Gokul V Subramaniam

Lance Lin

Kathiravan D

Jason Y Jiang

Baomin Liu

Xiyong Tian

Columbia Mishra

Twan Sing Loo

Jia Yan Go

Ruander Cardenas

Christopher M Moore

Hari Shanker Thakur

Evan Piotr Kuklinski

Ritu Bawa

Gerry Juan

Chin Kung Goh

Deepak Sekar

Kathiravan Dhandapani

George Baoci Sun

Shih Wei Nien

Chun-Ting Liu

Mikko Makinen

Nehakausar Pinjari

Sammi Wy Liu

Khal Ern See

Kavitha Nagarajan

Thermal Management Systems for electronic devices and related methods are disclosed. An example electronic housing includes a housing defining a cavity, electronics in the cavity, and a touch display over the electronics. A heat spreader has a first surface toward the electronics and a second surface opposite the first surface toward the touch display, where the heat spreader is to dissipate heat generated by the electronics. A glass cover is coupled to the housing and has a first side toward the touch display and a second side opposite the first side, where the glass cover is exposed external to the housing. An insulation layer is between the second surface of the heat spreader and the second side of the glass cover to restrict heat transfer from the electronics to the second side of the glass cover.

Thermal management systems for electronic devices and related methods

An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices

An Integrated Circuit (IC) assembly, comprising an IC package coupled to a substrate, and a subassembly comprising a thermal interface layer. The thermal interface layer comprises a phase change material (PCM) over the IC package. At least one thermoelectric cooling (TEC) apparatus is thermally coupled to the thermal interface layer.

Thermoelectric coolers combined with phase-change material in integrated circuit packages

Growing community of inventors

Bengaluru, India

Javed Shaikh