International Business Machines Corporation

Javad Haj-ali-Ahmadi

Richard Francis Frankeny

Karl Hermann

Jerome A Frankeny

Ronald E Hunt

Adolph B Habich

Ronald L Imken

Paul A Farrar

Rolf Wustrau

Edward C Hume, Iii

John A Williamson

Jacqueline A Shorter-Beauchamp

A method and apparatus are provided for placing a plurality of Stock Keeping Units (SKUs), e.g., brands in transport units wherein quantities of SKUs, not equal to standard SKU packages, e.g. cases, can be ordered. A material handling system, including a work area, robot, conveyors, and the like, is used in conjunction with a computer implemented planning method. The planning method determines the sequence for filling transport units by initially assigning transport units to the work area. Only one transport unit per order is assigned to the work area at a single time. The SKUs are then ranked depending on their difficulty in placement. If a partial package is required, it is considered more difficult that full packages and placed before the required full packages of that SKU. The planning method completes the oldest transport unit in the work area and attempts to place the most difficult SKUs first.

System and method for partial order filling

A memory module is built up from a power distribution assembly in the form of plates forming a capacitor of low inductance and a flexible circuit substrate. The circuit substrate is populated with precisely positioned contact pads for the power, read, write and address lines of memory chips that contact the substrate. Memory chips are fixed to heat spreaders and loaded into a chip holder which positions the chips for contact with the contact pads on the substrate. The substrate contact pads are plated to form dendritic crystals of palladium and the memory chips are provided with solder balls on the contact pads of the memory chip. The solder balls are held in contact with the contact pads by the compressive forces of clamping a heat sink over the heat spreaders for testing, and the assembly may be readily disassembled to replace any defective memory. The compression connection of the chips to the substrate may be relied on or the solder balls may be reflowed to establish permanent solder connections.

High density memory module

A method and apparatus is provided for testing integrated circuits and permanently affixing the ICs which are successfully tested to a product level carrier substrate. A modular test oven is used which allows the chips to be electrically and thermally tested with the chips non-permanently affixed to a carrier substrate. If all of the chips on the carrier substrate test good, then the temperature within the oven is elevated, thereby reflowing the solder balls and permanently affixing the chips to the carrier substrate.

Method for testing integrated circuits on a carrier substrate

A method and apparatus is provided for testing integrated circuits and permanently affixing the ICs which are successfully tested to a product level carrier substrate. A modular test oven is used which allows the chips to be electrically and thermally tested with the chips non-permanently affixed to a carrier substrate. If all of the chips on the carrier substrate test good, then the temperature within the oven is elevated, thereby reflowing the solder balls and permanently affixing the chips to the carrier substrate. This card can then be used in the manufacture of an electronic device without the necessity of reworking the burned-in ICs. Further, if any of the chips fail the burn-in testing, the time and overhead required for reworking is minimized since the chips are not permanently attached.

Modular test oven

A system is provided which utilizes a plurality of sequentially controlled magnetic repulsion punches arranged in a variable array to punch a constantly moving substrate. These punches are disposed adjacent the constant velocity substrate on which holes, or vias are formed as the punches are sequentially fired. The array of punches is placed at an angle with respect to the perpendicular of the direction of movement of the substrate. Thus, a delay is present between the time when the first punch must be fired and the firing of subsequent punches, due to the angle of the array. Therefore, due to this delay between the time the first punch must energized, and the energizing of subsequent punches a single power supply is capable of providing energy to a group of punches. Further, with the system of the present invention, it is possible to punch rows of holes lying in straight rows perpendicular to the direction of movement of the substrate and have different center to center distances on the same substrate, without the necessity of rearranging the array of punches and performing an additional punching operation.

Variable array punch

An electronic circuit packaging module includes a lower substrate, an upper cooling unit, and a frame disposed between the substrate and cooling unit. The substrate carries a plurality of integrated circuit chips with lead-outs to a plurality of downwardly protruding dimpled contact points disposed about the substrate periphery. The frame includes a plurality of insulative inserts about its periphery having conductive pins each with a lower extension extending below the insert and an upper contact point recessed within the insert. The cooling unit includes a plurality of fluid bags each in contact with a respective chip on the substrate for thermal management. A plurality of such modules are stacked in vertical registry with each downwardly protruding dimple of a module extending into a respective insert recess of an adjacent module. Electrical contact is thus effected between the respective dimples on the lower surface of the upper module and respective upper contact points of the recessed pins on the upper surface of the cover module. The lower extension of the pins of each insert of a given module thus extend into contact with the upper surface of a respective dimple of an adjacent lower module. In this manner, vertical electrical interconnection is established through the pins when mated in vertical registry, establishing a plurality of conductive paths in the Z axis.

Modular electronic packaging system

An interconnect strip is provided for effecting electrical interconnection between pluralities of conductor pads disposed on circuit boards or the like in a high density configuration. The strip is fabricated from a polymer film carrier having laminated thereon a metal foil with preselected spring properties. After lamination, lithographic techniques from a series of electrically isolated metallic beams on the carrier. Additional chemical processing removes portions of the carrier at opposing sides of the strip to expose opposing ends of the beams which extend beyond the carrier parallel to one another in opposing directions outwards from the carrier. By urging the pads towards respective beam ends of the strip disposed between the pads until mating engagement therewith, a plurality of electrical interconnections are established through the beams. Flexural properties of the strip provide a low insertion force connection for a high density of conductors wherein the spring action of the strip assures favorable contact forces to the pads. The exposed film side of the strip may also be metalized and provided with beams or interconnected to beams on opposing side of the film by vias thereby providing a ground plane.

High density interconnect strip

A system for providing low insertion force electrical interconnections between high density contacts for use in interconnecting circuit packages. A housing has disposed therein one or more pre-buckled beam connectors. Each connector has a resilient insulative strip carrying a plurality of buckling beams electrically isolated from each other. The beams are aligned on the plane defining the strip in parallel with ends extending away from the strip edges in opposing directions. Means are provided for deforming the strip within the housing prior to effecting desired interconnections whereby the beams are pre-buckled. Upon urging contacts into proximity with the beam ends, the buckling force is released causing each beam's ends to be urged away from the strip into engagement with respective contacts, thereby effecting desired interconnection between contacts and through one or more beams.

Growing community of inventors

Austin, TX, United States of America

Javad Haj-ali-Ahmadi