Industrial Technology Research Institute

Jauder Jeng

Hsien-Kuang Lin

Tien-Shou Shieh

Sue-May Chen

Chi-Fu Tseng

Te-Yi Chang

Tsung-Yi Chou

Man-Lin Chen

Pei-Ching Liu

Su-Huey Chen

Chin-Hui Chou

Yu-Lin Liu

Ming-Hsueh Chiang

A double-sided optically clear adhesive is provided. The double-sided optically clear adhesive includes a first adhesive layer and a second adhesive layer. The first adhesive layer includes a first resin and a first thermal-crosslinking agent. The first resin includes a hydroxyl group. The first thermal-crosslinking agent includes a first group. The second adhesive layer includes a second resin and a second thermal-crosslinking agent. The second resin includes a hydroxyl group. The second thermal-crosslinking agent includes a second group. The ratio of the equivalent number of the first group of the first thermal-crosslinking agent to the equivalent number of the hydroxyl group of the first resin is represented by r. The ratio of the equivalent number of the second group of the second thermal-crosslinking agent to the equivalent number of the hydroxyl group of the second resin is represented by r, wherein r<r≤0.8 and r−r≥0.025.

Double-sided optically clear adhesive and multilayer structure including the same

An oligomer is formed by reacting a diacid monomer with (a) epoxy resin or (b) glycidyl methacrylate, wherein the diacid monomer has a chemical structure of wherein X is &#x2014;O&#x2014;, and each Ris independently CH, CHF, CHF, or CF. A composition containing the oligomer can be cured to serve as a sealant of an optoelectronic device, and the sealant can be lifted off by a laser beam irradiation.

Oligomer, composition, packaging structure, and method of disassembling packaging structure

A photosensitive composition and a photoresist are provided. The photoresist is formed by compounding a photosensitive composition. The photosensitive composition includes a binder agent, a first photomonomer, and a photo initiator. The first photomonomer has at least a lactic oligomer and at least two unsaturated acrylic functional groups, wherein the first photomonomer has an amount of about 25-95 parts by weight relative to 100 parts by weight of a solid content of the binder agent. The photoinitiator has an amount of about 0.5-15 parts by weight relative to 100 parts by weight of the solid content of the binder agent.

Photosensitive composition and photoresist

A photosensitive composition and a photoresist are provided. The photoresist is formed by compounding a photosensitive composition. The photosensitive composition comprises a binder agent, a photomonomer and a photoinitiator. The binder agent has a chemical structure comprising following repeating unit: Ris H or CH, n is 2-40 of integer. The photomonomer has an amount of about 25-95 parts by weight relative to 100 parts by weight of a solid content of the binder agent. The photo initiator has an amount of about 0.5-15 parts by weight relative to 100 parts by weight of the solid content of the binder agent.

A sealant composition is provided. The sealant composition includes (a) an oligomer including an unsaturated mono-carboxylic acid modified bisphenol A epoxy resin and an unsaturated mono-carboxylic acid modified bisphenol F epoxy resin, wherein an equivalence ratio of the bisphenol A epoxy resin to the bisphenol F epoxy resin is 0.05:0.95 to 0.3:0.7, the bisphenol A epoxy resin has a melting point higher than 40&#xb0; C. and the bisphenol F epoxy resin has a melting point lower than 40&#xb0; C.; (b) an epoxy resin having at least two or more than two epoxy groups; and (c) a photoinitiator.

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Jauder Jeng