Other

Industrial Technology Research Institute

National Chung Hsing University

Chung Shan Medical University

Jau-Liang Chen

Yu-Lung Lo

Sheng-Lung Wu

Jhy-Cherng Tsai

Shean-Juinn Chiou

Gou-Jen Wang

Jong-Fang Ho

Tien-Lou Ho

An electrical wheelchair includes a vertical rotating shaft connected fixedly to a seat member and journalled on a frame of a chair body, and a worm unit for transferring rotation of a motor shaft to the rotating shaft. A wheel-controlling switch is disposed on the seat member, and is operable to rotate a driving wheel unit. A rotation-controlling switch is also disposed on the seat member, and is operable to rotate the rotating shaft and the seat member by any desired angle smaller than and equal to 360&#xb0;. When the seat member rotates from a frontward position by 180&#xb0;, the rotational direction of the driving wheel unit is reversed under automatic control. As such, forward and rearward movement of the wheelchair can be conducted with ease.

Electrical wheelchair with an electrical seat-rotating device

A method of determining efficiently parameters in chemical-mechanical polishing, especially a method includes a Neural-Taguchi method to seek the best parameter set to increase the quantity of output. This invention involves a time parameter to achieve end-point detection on line during the CMP procedure and also completes a maximum material removal rate (MRR) and a minimum within wafer non-uniformity (WIWNU) at the same time.

Method for determining efficiently parameters in chemical-mechanical polishing (CMP)

A method of linkage with springs mold is provided to simulate the condition of forces acting on a bonding wire for semiconductor package. The bonding wire profile can be formed by means of combining several sets of linkage with springs, wherein the coefficients of elasticity and plasticity of the springs are determined by the bending angle of two linkages which simulates the elastic-plastic deformation of the wires. The operational model can be simplified and the time can be saved by using the multiple degrees of freedom of the links/springs to analyze the profile and forces on the fine wire. Necking and fracture during formation process of the bonding wire can be avoided by the present method and design to achieve the optimum design for wire bonding profiles.

Profile design for wire bonding

Growing community of inventors

Taichung, Taiwan

Jau-Liang Chen