Omnivision Technologies, Inc.

Visera Technologies Company Limited

E-pin Optical Industry Co., Ltd.

Other

Jau-Jan Deng

Wei-Ping Chen

Chuen-Yi Yin

Tingyu Cheng

Yun-Chiang Hsu

Wei-Feng Lin

Teng-Sheng Chen

Tsung-Wei Wan

Yi-Wei Liu

Wei-Chung Chang

Min-Chih Liao

Regis Fan

Shih-Hsin Hsu

San-Woei Shyu

Paul Wickboldt

Chia-Wei Wang

Chia-Yang Chang

Guo-Zen Chen

I-Lin Chu

Jui-Yi Chiu

Chun-Chi Lin

I-Lung Lu

Kuang-Ju Wang

Chia-Ching Wang

Chun-Sheng Fan

Ramakrishna Kakarala

Pai-Chun Peter Zung

Suganda Jutamulia

Ming-Hua Wen

Chien-Min Wu

Ting-Yu Cheng

Wei Ping Chen

Chun-Jen Wei

Yi-Fan Lin

Chin-Hsing Lin

Wen-Huang Liu

Yu-Shu Kao

Wei Lin Tung

A camera lens module includes an image sensor and a sandwiched lens structure formed over the image sensor, the sandwiched lens structure including a layer lens between a first glass substrate and a second glass substrate, and a baffle formed between the layer lens and the first glass substrate or between the layer lens and the second glass substrate.

Camera module having sandwiched lens structure in between two glass substrates

A fingerprint sensor has an array of microlenses formed on an upper surface of a transparent substrate; with a lower surface of the transparent substrate bonded to an upper surface of a fingerprint image sensor integrated circuit. In embodiments, it includes one or two filter layers on the lower surface of the transparent substrate, and may also include masked black baffle layers on one or more of the upper and lower surface of the transparent substrate. The sensor is made by forming the microlenses and black baffle layers on the transparent substrate, then aligning the transparent substrate to a wafer of fingerprint sensor integrated circuits and bonding the transparent substrate to the wafer, then dicing the wafer into individual fingerprint sensors.

Fingerprint sensor with wafer-bonded microlens array

An image sensor for imaging fingerprints has multiple photodiode groups each having a field of view determined by pinholes of upper and lower mask layers and a metal layer, each field of view being through a microlens. Many photodiode groups have fields of view outwardly splayed from a group having a center-direct field of view. A diameter of pinholes of the metal layer distant from the group having a center-direct field of view have larger diameter than a pinhole of the photodiode group having a center-direct field of view. A method of matching illumination of a group of photodiodes with center-direct field of view to illumination of photodiode groups having outwardly splayed fields of view includes sizing a pinhole in the metal layer of photodiode groups with outwardly splayed fields of view larger than a pinhole associated with of photodiode groups having a center-direct field of view.

Multi-microlens fingerprint sensor with photodiodes in groups; each photodiode of the photodiode groups having a field of view through a microlens, pinholes of an upper black mask layer, and pinholes of a metal layer having pinhole rings with pinholes of an outer ring larger than those of an inner ring

A method includes capturing an image from a scene with an image sensor. The image sensor has a plurality of spectral pixels and a plurality of image pixels. The method also includes collecting gathered data from the spectral-imaging array based on the light received. The gathered data is separated into spectral pixel data and image pixel data. The spectral pixel data is provided by the spectral pixels and the image pixel data is provided by the image pixels. The method includes both generating spectral information of the image based on the spectral pixel data and generating image information of the image based on the image pixel data.

System and method for using an image sensor having image pixels and spectral pixels

An under-display optical fingerprint sensors employing microlens arrays (MLAs) and an opaque aperture layer includes high aspect-ratio metal aperture structures for efficient angular signal filtering and stray light control. Instead of relying on one or more opaque aperture baffle-layers, embodiments disclosed herein utilize an image sensor's inherent metal layers for filtering signals originated from unwanted angular ranges and blocking undesired stray light could achieve similar or better performance with simplified process flow and lower cost. Layers from the sensors' inherent metal layers are brought into the sensing area on purpose to form the high aspect-ratio metal aperture structure. The metal layers in the sensing area may include apertures aligned to apertures in the opaque layer, and may also be grounded.

Optical fingerprint sensor with high aspect-ratio metal aperture structures

A self-illuminating camera includes a camera and an illuminator. The camera includes an image sensor and a first lens of a pair of two identical lenses. The illuminator is adjacent to the camera and includes a light source and a second lens of the pair of two identical lenses. The illuminator has a field of illumination that at least partially overlaps a field of view of the camera.

Self-illuminating camera

A chip-level camera includes an image sensor; a concave L1 lens element on an inside surface of a first substrate; a convex L2 lens element on a first surface of a second substrate; a diaphragm stop on a second surface of the second substrate or on a first surface of a third substrate, the diaphragm stop between the second and third substrates; a convex L3 lens element on a second surface of the third substrate spaced from the image sensor; a first spacer holding first substrate at a predetermined distance from the second substrate; and a second spacer holding the second substrate a predetermined distance from the image sensor. In embodiments, lens element L1 has concave aspheric radius of R1, and lens L2 convex aspheric radius of R2, such that 1.3<ABS(R2/R1)<2.2 and/or lens L3 has convex aspheric radius R3, where 1.1<ABS(R3/R1)<2.4.

Multi-element wide-field lens for wafer-assembled chip-cube cameras

A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.

Endoscope tip assembly using truncated trapezoid cavity interposer to allow coplanar camera and LEDs in small-diameter endoscopes

An image sensor for imaging fingerprints has multiple photodiode groups each with field of view through a microlens determined by optical characteristics of the microlens and locations of the microlens and openings of upper and lower mask layers. Many photodiode groups have fields of view outwardly splayed from a center-direct field of view. A diameter of openings of the upper mask layer distant from the group having a center-direct field of view is larger than openings of a photodiode group having a center-direct field of view. A method of matching illumination of a group of photodiodes with center-direct field of view to illumination of photodiode groups having outwardly splayed fields of view includes sizing openings in the upper mask layer of photodiode groups with outwardly splayed fields of view larger than openings in the upper mask layer associated with photodiode groups having center-direct field of view.

Thin, multi-lens, optical fingerprint sensor adapted to image through cell phone displays and with multiple photodiode groups each having separate fields of view for each microlens

Endoscope tip assembly using cavity interposer to allow coplanar camera and LEDs

An electronic camera assembly includes a camera chip cube bonded to camera bondpads of an interposer; at least one light-emitting diode (LED) bonded to LED bondpads of the interposer at the same height as the camera bondpads; and a housing extending from the interposer and LEDs to the height of the camera chip cube, with light guides extending from the LEDs through the housing to a top of the housing. In embodiments, the electronic camera assembly includes a cable coupled to the interposer. In typical embodiments the camera chip cube has footprint dimensions of less than three and a half millimeters square.

Electronic camera module with integral LED and light-pipe illuminator

A passive speckle-suppressing diffuser includes a microlens array for diffusing a light field originating from one or more coherent light beams, and a diffractive optical element mounted in series with the microlens array and having a pixelated thickness distribution, characterized by a spatial variation across the diffractive optical element, to impose a spatially varying phase shift on the light field. The pixelated thickness distribution may be configured such that the spatially varying phase shift suppresses speckle of the light field while minimizing introduction of distinct diffraction structure. A method for passive speckle-suppressing diffusion a light field originating from one or more coherent light beams may include refracting the light field, through a microlens array, to diffuse the light field, and imposing a spatially varying phase shift on the light field to decohere the light field without introducing any first-order diffraction components deflected beyond angle spread introduced by the microlens array.

Passive speckle-suppressing diffusers and associated methods and illuminators

A multiple-lens optical fingerprint reader for reading fingerprints through a display has a spacer; and multiple microlenses with concave and convex surfaces in a microlens array, each microlens of multiple lenses focuses light arriving at that microlens from a finger adjacent the display through the spacer forms an image on associated photosensors on a photosensor array of an image sensor integrated circuit. A method of verifying identity of a user includes illuminating a finger of the user with an OLED display; focusing light from the finger through arrayed microlenses onto a photosensor array, reading the array into overlapping electronic fingerprint images; extracting features from the overlapping fingerprint images or from a stitched fingerprint image, and comparing the features to features of at least one user in a library of features and associated with one or more fingers of one or more authorized users.

Thin, multi-lens, optical fingerprint sensor adapted to image through cell phone displays

An optical fingerprint sensor with spoof detection includes a plurality of lenses, an image sensor including a pixel array that includes a plurality of first photodiodes and a plurality of second photodiodes, and at least one apertured baffle-layer having a plurality of aperture stops, wherein each second photodiode is configured to detect light having passed through a lens and at least one aperture stop not aligned with the lens along an optical axis. A method for detecting spoof fingerprints detected using an optical fingerprint sensor includes detecting large-angle light incident on a plurality of anti-spoof photodiodes, wherein the plurality of anti-spoof photodiodes is interleaved with a plurality of imaging photodiodes, determining an angular distribution of light based at least in part one the large-angle light, and detecting spoof fingerprints based at least in part on the angular distribution of light.

Optical fingerprint sensor with spoof detection and associated method

An endoscope imager includes a system-in-package and a specularly reflective surface. The system-in-package includes (a) a camera module having an imaging lens with an optical axis and (b) an illumination unit. The system-in-package includes (a) a camera module having an imaging lens with an optical axis and (b) an illumination unit configured to emit illumination propagating in a direction away from the imaging lens, the direction having a component parallel to the optical axis. The specularly reflective surface faces the imaging lens and forming an oblique angle with the optical axis, to deflect the illumination toward a scene and deflect light from the scene toward the camera module.

Endoscope imager and associated method

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Taipei, Taiwan

Jau-Jan Deng