Aluminum Company of America

Jau-Ho Jean

Tapan K Gupta

William D Straub

A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 5.0 and a TCE of 2.0-4.0 ppm/c. The composition is formed from a mixture comprising 25-50 weight percent of a low temperature glass selected from the group consisting of borosilicate glass, zinc borate glass and combinations thereof, 50-75 weight percent of a high temperature glass selected from the group consisting of high silica glass, titanium silicate glass and combinations thereof, and 1-10 weight percent of ceramic material having a particle size of less than about 3 microns. The mixture can be combined with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium. A preferred ceramic material is colloidal alumina.

Suppression of crystal growth in low dielectric inorganic composition

A ceramic composition for forming ceramic dielectric body having a dielectric constant of less than about 5.5 and a TCE of less than about 5.0 ppm/.degree.C. The composition comprises a mixture of finely divided particles of 10-90 vol. % borosilicate glass and 10-90 vol. % of a material selected from the group consisting of Ga.sub.2 O.sub.3, Ga.sub.2 SiO.sub.5, Ga.sub.2 TiO.sub.5, GaAs, GaPO.sub.4 and any gallium-contained compounds to inhibit the formation of crystalline forms of silica. The composition can be used with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.

Devitrification inhibitor in low dielectric borosilicate glass

A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 5.5 and a TCE of less than about 3.5 ppm/.degree.C. The composition comprises a mixture of finely divided particles of 20-80 vol. % borosilicate glass and 20-80 vol. % of Al.sub.x B.sub.y O.sub.z wherein x is in the range of 4 to 22, y is in the range of 2 to 5, and z is in the range of 9 to 36. The Al.sub.x B.sub.y O.sub.z inhibits the formation of crystalline forms of silica. The composition can be used with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.

Aluminum borate devitrification inhibitor in low dielectric borosilicate

A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.2. The composition comprises a mixture of finely divided particles of 25-50 vol. % borosilicate glass and 50-75 vol. % high silica glass. The composition can be used with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.

Low dielectric inorganic composition for multilayer ceramic package

A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.2 and a TCE of less than about 4.0 ppm/c. The composition comprises a mixture of finely divided particles of 25-50 vol. % borosilicate glass and 50-75 vol. % high silica glass and sufficient amounts of crystalline ceramic material to inhibit the formation of crystalline forms of silica. The composition can be used with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.

Crystal growth inhibitor for glassy low dielectric inorganic composition

A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 5.5 and a TCE of less than about 4.5 ppm/.degree. C. The composition comprises a mixture of finely divided particles of 25-50 vol. % borosilicate glass 40-75 vol. % silica glass and 1-40 wt. % of a material selected from the group consisting of Ga.sub.2 O.sub.3, Ga.sub.2 SiO.sub.5, Ga.sub.2 TiO.sub.5, GaAs, GaPO.sub.4 and any gallium-contained compounds to inhibit the formation of crystalline forms of silica. The composition can be used with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.

Gallium-containing glassy low dielectric ceramic compositions

A glass-ceramic composition for forming a glass-ceramic dielectric body having a dielectric constant of less than about 4.5, a firing temperature of less than about 950.degree. C. and a sintered density of greater than 95% theoretical density. The composition is formed from a mixture consisting essentially of finely divided particles of 40-50 vol. % borosilicate glass and 50-60 vol. % cordierite. The borosilicate glass comprises approximately 20-35 wt. % B.sub.2 O.sub.3 and approximately 60-75 wt. % SiO.sub.2. The exact particle size ratio of the cordierite to borosilicate glass that is used will depend on the proportions of the components, the desired fired density and the firing temperature. The mixture is fired at a temperature of less than 1000.degree. C.

Dielectric composition containing cordierite and glass

A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.5 and a TCE of less than about 4.0 ppm/c. The composition comprises a mixture of 20-50 wt. % borosilicate glass 40-75 wt. % of a glass selected from the group consisting of glass containing 95-98 wt. % silica, titanium silicate glass and combinations thereof and sufficient amounts of gallium to inhibit the formation of crystalline forms of silica. The composition can be combined with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.

Gallium crystal growth inhibitor for glassy low dielectric inorganic

A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.2 at 1 MHz and a linear thermal expansion coefficient of 2.5-3.0 ppm/.degree.C. from room temperature to 200.degree. C. The composition comprises a mixture of finely divided particles of 20-50 wt. % borosilicate glass, 40-75 wt. % titanium silicate glass and sufficient amounts of crystalline ceramic material to inhibit the formation of crystalline forms of silica. The composition can be used with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.

A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.2 at 1 MHz and a linear thermal expansion coefficient of 2.5-3.0 ppm/.degree. C. from room temperature to 200.degree. C. The composition comprises a mixture of finely divided particles of 25-50 vol. % borosilicate glass and 50-75 vol. % titanium silicate glass. The composition can be used with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.

A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.2 and a TCE of less than about 4.0 ppm/c. The composition comprises a mixture of finely divided particles of 25-50 weight percent borosilicate glass and 50-75 weight percent high silica glass and 1-25 weight percent sufficient of crystalline ceramic material to inhibit the formation of crystalline forms of silica. The high silica glass contains essentially 0.5-1 wt. % alumina, 1-5 wt. % B.sub.2 O and approximately 95-98 wt. % SiO.sub.2. The mixture is fired at a temperature of less than 1000.degree. C.

A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.2. The composition is formed from a mixture of finely divided particles of 25-50 vol. % borosilicate glass and 50-75 vol. % high silica glass. The borosilicate glass comprises approximately 20-35 wt. % B.sub.2 O.sub.3 and approximately 60-80 wt. % SiO.sub.2. The high silica glass contains essentially 0.5-1 wt. % alumina, 1-5 wt. % B.sub.2 O.sub.3 and approximately 95-98 wt. % SiO.sub.2. The composition can be fired at a temperature of less than 1000.degree. C.

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Jau-Ho Jean