International Business Machines Corporation

Jasvir Singh Jaspal

Mukta G Farooq

Roger Allan Quon

H Bernhard Pogge

Thomas Edward Lombardi

William Francis Landers

Kris V Srikrishnan

Michael J Sullivan

Paul S Ho

James R Lloyd

James M Oberschmidt

Hai Pham Longworth

Devandra Gupta

David P Fouts

A system and method comprises depositing a dielectric layer on a substrate and depositing a metal layer on the dielectric layer. The system and method further includes depositing a high temperature diffusion barrier metal cap on the metal layer. The system and method further includes depositing a second dielectric layer on the high temperature diffusion barrier metal cap and the first dielectric layer, and etching a via into the second dielectric layer, such that the high temperature diffusion barrier metal cap is exposed. The system and method further includes depositing an under bump metallurgy in the via, and forming a C4 ball on the under bump metallurgy layer.

Structure and method to improve current-carrying capabilities of C4 joints

Electromigration activity is decreased and lifetime is extended in solder stripes employed as conductors and terminals on microelectronic devices by forming an alloy of a solute element, such as copper, with tin in a lead/tin solder and providing a substantially uniform distribution of particles of the intermetallic compound in the solder. The concentration of the solute element is maintained at less than about three times the tin concentration and less than about 10% of the amount of the solder.

Electromigration lifetime increase of lead base alloys

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Poughkeepsie, NY, United States of America

Jasvir Singh Jaspal