Technetics Group LLC

Alameda Applied Sciences Corporation

Jason Wright

Angus McFadden

Mahadevan Krishnan

Andrew N Gerhan

Michael Y Au

Mark S Whitlow

Jason W Burns

Elaine Motyka

Rick Oliver

Kamal Frikach

Benjamin Tang

Kristi Wilson

Kelan Champagne

Michael D McFarland

Brian L Bures

Tim Egge

Eric Tobin

Nader Kalkhoran

Several embodiments of the present technology are directed to actively controlling a temperature of a substrate in a chamber during manufacturing of a material or thin film. In some embodiments, the method can include cooling or heating the substrate to have a temperature within a target range, depositing a material over a surface of the substrate, and controlling the temperature of the substrate while the material is being deposited. In some embodiments, controlling the temperature of the substrate can include removing thermal energy from the substrate by directing a fluid over the substrate to maintain the temperature of the substrate within a target range throughout the deposition process.

Deposition processing systems having active temperature control and associated methods

Techniques for depositing a functionally integrated coating structure on a substrate are provided. An example method according to the disclosure includes receiving the substrate into a process chamber of a multi-process ion beam assisted deposition system, disposing the substrate in a first zone including a first evaporator species and a first ion beam, wherein the first evaporator species is Aluminum Oxide (Al2O3), disposing the substrate in a second zone including a second evaporator species and a second ion beam, wherein the second evaporator species is Yttrium Oxide (Y2O3), and disposing the substrate in a third zone including a third evaporator species and a third ion beam, wherein the third evaporator species is Yttrium Fluoride (YF3).

Functionally integrated coating structures

A method of depositing material to manufacture an electrostatic chuck is provided. The method first deposits at least one layer of a first dielectric material on a handle using spin coating and/or direct spraying method. A functional electric layer is next deposited on the at least one layer of the first dielectric material. Finally, the electrostatic chuck if formed by depositing at least one layer of a second dielectric material on the functional electric layer and the first dielectric material using spin coating and/or direct spraying method.

Methods of manufacturing electrostatic chucks

Several embodiments of the present technology are directed to bonding sheets having enhanced plasma resistant characteristics, and being used to bond to semiconductor devices. In some embodiments, a bonding sheet in accordance with the present technology comprises a base bond material having one or more thermal conductivity elements embedded therein, and one or more etched openings formed around particular regions or corresponding features of the adjacent semiconductor components. The bond material can include PDMS, FFKM, or a silicon-based polymer, and the etch resistant components can include PEEK, or PEEK-coated components.

Bond materials with enhanced plasma resistant characteristics and associated methods

The technology of the present application provides an apparatus for sealing and filtering. The apparatus includes a sealing component and a filtering component. The sealing component has an annular structure and a first connecting component. The annular structure includes a sidewall defining a recess. The first connecting component extends from the annular structure in a first direction. The filtering component has a filtering material and a second connecting component. The filtering material has a flat structure. The filter material is configured to filter fluid passing therein in a second direction. The sealing component and the filtering component are coupled by the first connecting component and the second connecting component.

Metal seal with an integral filter

An apparatus for deposition of plasma reaction films includes a substrate for the deposition of either thin or thick films. The substrate also allows for a film deposition which adheres to the substrate, and also films which may be removed after deposition. The cathode may be fabricated from individual wires, or it may be fabricated from a single conductor. A macro-particle filter which preferentially traps larger particles may be introduced between a porous cathode and the deposition surface. The macro-particle filter may also carry electrical current as is useful for generating a magnetic field such that a Lorentz force acts preferentially on ionized particles, allowing them to pass through the filter while trapping macroparticles that are not influenced by the magnetic field.

Coaxial plasma arc vapor deposition apparatus and method

An apparatus for the deposition of a variable thickness coating onto the inside of a cylindrical tube comprises a variable pressure gas, an cathode coaxially positioned within the cylinder, and a voltage source applied between the cathode and cylindrical tube, which functions as an anode. A radial plasma arc is generated between the anode and cathode at a starting point on the cylinder, and the plasma arc travels down the central axis of the cylinder, providing a helical deposition region on the inside of the cylinder. Selection of the combination of cathode material and gas enable the plasma to generate ionic material which is deposited on the anodic cylinder in the region of the plasma. By varying the pressure of variable pressure gas for each helical path, it is possible to vary the composition of this deposition film.

A Liquid Metal Ion Thruster (LMIT) has a substrate having a plurality of pedestals, one end of the pedestal attached to the substrate, and the opposing end of the pedestal having a tip, the pedestals having grooves and the substrate also having grooves coupled to each other and to a source of liquid metal. An extractor electrode positioned parallel to the substrate and above the pedestal tips provides an electrostatic extraction field sufficient to accelerate ions from the tips of the pedestals through the extractor electrode. A series of focusing electrodes with matching apertures provides a flow of substantially parallel ion trajectories, and an optional negative ion source provides a charge neutralization to prevent space charge spreading of the exiting accelerated ions. The assembly is suitable for providing thrust for a satellite while maintaining high operating efficiencies.

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San Mateo, CA, United States of America

Jason Wright