Eagle Technology, LLC

Jason Thompson

Voi Nguyen

Charles Weirick

Marcus Ni

Matthew J Bauer

Jamel Burruss

Mu-jen Yang

Robert J Mulligan

Robert Wortman

Louis J Rendek, Jr

Bernie J Gilley

Brandon T Dubas

Beau Guidry

An electronic assembly may include a chassis, and electronic modules mounted within the chassis. Each electronic module may include a printed circuit substrate, heat-generating electronic components mounted on the printed circuit substrate, and a heat sink body mounted to the printed circuit substrate and having a plurality of heat pipe receiving passageways extending between opposing side edges and overlying corresponding heat-generating components. A respective elongate, passive, heat pipe may extend within each heat pipe receiving passageway and be removably fastened to at least one end to the heat sink body for enhanced conductive heat transport.

Electronic assemblies having embedded passive heat pipes and associated method

An electronic assembly includes a chassis having electronic module mounting positions, each having an electronic module received therein. A module recess is adjacent a first end of the electronic module and a module roller is adjacent a second end. A sealing retainer is coupled between the chassis and each electronic module, and includes a cooling gas passageway aligned with a chassis cooling gas passageway and a module cooling gas passageway. The sealing retainer includes a rigid retainer body having a retainer recess adjacent a first end to receive the module roller when the electronic module is in an inserted position. A retainer roller is received in a module recess and a compressible retainer body is between the rigid retainer body and the chassis.

Electronic assembly having sealing retainer coupling an electronic module and associated method

A method of forming a nanodiamond article includes forming a continuous film on a substrate using electrophoretic deposition. The continuous film includes greater than 50% nanodiamond concentration by volume. A nanodiamond article includes a continuous film on a substrate having greater than 50% nanodiamond concentration by volume.

Nanodiamond article having a high concentration nanodiamond film and associated method of making

A sealing retainer may be coupled between a chassis and an electronic module. The sealing retainer includes a retainer body to be coupled to the chassis and a first cooling gas passageway that may be aligned with a chassis cooling gas passageway. A gas seal body has a second cooling gas passageway aligned with the first cooling gas passageway and coupled to the retainer body and movable between a retracted position that permits insertion and removal of the electronic module and an extended position that seals against the electronic module.

Sealing retainer to be coupled between chassis and electronic module and associated method

A method for making a nanodiamond article includes applying an adhesion promoting layer to a substrate, and electrophoretically depositing a nanodiamond film on the substrate with the adhesion promoting layer thereon in a solution to make the nanodiamond article. The nanodiamond article may include a substrate, a nanodiamond film over the substrate, and the adhesion promoting layer between the substrate and the nanodiamond film.

Nanodiamond article and associated methods of fabrication

An electronic assembly may include a chassis having electronic module mounting positions, each having a chassis cooling gas passageway and an electronic module received in each electronic module mounting position. A sealing retainer may be coupled between the chassis and each electronic module, and includes a cooling gas passageway aligned with the chassis cooling gas passageway and a module cooling gas passageway of a respective electronic module. The sealing retainer may include a retainer body, and a gas seal body coupled to the retainer body and movable between retracted and extended positions. The gas seal body in the retracted position permits insertion and removal of the electronic module, and in the extended position seals against the electronic module.

An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat sink body, and a heat transfer assembly between the heat generating component and the heat sink body. The heat transfer assembly may include a flexible, heat conductive layer having a first portion in thermal contact with the heat generating component and a second portion in thermal contact with the heat sink body. The first and second portions are thermally coupled, and a compressible layer is between the first and second portions of the flexible, heat conductive layer.

Electronic device having flexible, heat conductive layer and associated methods

An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat transfer rail extending along an edge of circuit board and coupled to the heat generating component, a housing covering the circuit board, and a heat transfer clamp between the heat transfer rail and the housing. The heat transfer clamp includes a flexible, heat conductive layer having a first portion in thermal contact with the heat transfer rail and a second portion in thermal contact with the housing. The first and second portions are thermally coupled, and a clamp and a compressible layer thereon extends between the first and second portions of the flexible, heat conductive layer.

Electronic device having heat transfer clamp and associated methods

An electronic device may include a backplane and an electrical connector carried by a front side of the backplane, and a circuit board assembly removably coupled to the electrical connector. Each circuit board assembly may include a circuit board and electronic components carried by the circuit board and generating waste heat, and a cooling fluid arrangement thermally coupled to the electronic components. The electronic device may include a cooling fluid manifold, and a pair of multi-functional tubes that provide alignment, keying, structural rigidity and fluid supply and return capabilities extending between the cooling fluid manifold and the cooling fluid arrangement.

Electronic device with cooling fluid manifold and multi-function cooling fluid tubes with related electronics cabinet and associated methods

Systems () and methods () for inserting an electronic module in a structure. The methods comprise: sliding at least one glide mechanism on a rail of the structure or a surface of the electronic module as the electronic module is being inserted into the structure; actuating a coupler to secure the electronic module to the rail and compress a thermal interface material between the electronic module and the rail; thus causing the glide mechanism to be retracted into the electronic module or rail while the coupler is being actuated. The thermal interface material first comes in contact with the rail while the coupler is being actuated. The glide mechanism is integrated with the electronic module or the rail and is resiliently biased in a direction away from the electronic module or rail so as to partially extend out from the electronic module in a direction towards the electronic module or rail.

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Melbourne, FL, United States of America

Jason Thompson