Dow Corning Corporation

Dow Global Technolgoies LLC

Dow Silicones Corporation

Jason Suhr

Eric S Moyer

Peng-Fei Fu

Brian M Clark

Joel McDonald

Michelle R Cummings

Bradley W Tuft

Rachel Rademacher

A composition contains a blend of linear and resinous alkenyl functionalized polyorganosiloxanes, a blend of linear and resinous silyl hydride functionalized polyorganosiloxanes, and a hydrosilylation catalyst where the linear silyl hydride functionalized polyorganosiloxanes has a ratio of D/Dthat is greater than 2.0 and less than 14, the molar and the ratio of silyl hydride hydrogens to the sum of terminal alkenyl functionality on the alkenyl functionalized polyorganosiloxane is 1.2-2.2.

Rapid hydrosilylation cure composition

A coatable resin solution capable of forming a coating when applied to the surface of a substrate that is photo-patternable and developable as a dielectric material upon exposure to ultraviolet radiation is provided. The resin solution comprises a silsequioxane-based (SSQ-based) resin, at least one initiator, and an organic solvent. The SSQ-based resin includes both a hydride component and at least one photo-curable component. The resulting coating exhibits a dielectric constant that is less than or equal to about 3.5.

Photo-patternable and developable silsesquioxane resins for use in device fabrication

A silsesquioxane resin is applied over the patterned photo-resist and cured at the pattern surface to produce a cured silsesquioxane resin on the pattern surface. The uncured silsesquioxane resin layer is then removed leaving the cured silsesquioxane resin on the pattern surface. The cured silsesquioxane resin on horizontal surfaces is removed to expose the underlying photo-resist. This photo-resist is removed leaving a pattern of cured silsesquioxane. Optionally, the new pattern can be transferred into the underlying layer(s).

Method and materials for double patterning

An antireflective coating compositions comprising (I) a silsesquioxane resin (II) a compound selected from photo-acid generators and thermal acid generators; and (III) a solvent wherein in the silsesquioxane resin contains a carboxylic acid forming group or a sulfuric acid forming group.

Growing community of inventors

Coleman, MI, United States of America

Jason Suhr