Micron Technology Incorporated

Powerwave Technologies, Inc.

Intel Corporation

Jason Snodgress

Jason M Brand

Richard Emil Sweeney

Steven R Eskildsen

John G Meyers

Richard B Foehringer

A phase change memory array may include at least one cell used to determine whether the array has been altered by thermal exposure over time. The cell may be the same or different from the other cells. In some embodiments, the cell is only read in response to an event. If, in response to that reading, it is determined that the cell has changed state or resistance, it may deduce whether the change is a result of thermal exposure. Corrective measures may then be taken.

Apparatuses and methods for sensing a phase change test cell and determining changes to the test cell resistance due to thermal exposure

A phase change memory array may include at least one cell used to determine whether the array has been altered by thermal exposure over time. The cell may be the same or different from the other cells. In some embodiments, the cell is only read in response to an event. If in response to that reading, it is determined that the cell has changed state or resistance, it may deduce whether the change is a result of thermal exposure. Corrective measures may then be taken.

Apparatuses and methods for sensing a phase-change test cell and determining changes to the test cell resistance due to thermal exposure

Sensing phase-change memory/test cells for determining whether a cell resistance has changed due to thermal exposure

A method includes populating a circuit board with components, and encapsulating the circuit board and the components with a material. The method further includes separating the circuit board into a plurality of separate devices.

Packaging method for circuit board

Methods of assembling a coupler are provided in which a first printed circuit board is provided, and a second printed circuit board is then surface mounted on the first printed circuit board. The first printed circuit board and the second printed circuit board are then electrically and mechanically connected to provide a coupler having a shielded region defined between the first printed circuit board and the second printed circuit board. The shielded region at least partly surrounds a coupler circuit disposed therein.

Low cost highly isolated RF coupler

A surface mount technology ('SMT') apparatus for use in routing radio frequencies ('RF') between cavities that require a high level of isolation on a single printed circuit board (&#x201c;PCB&#x201d;). The SMT part is attached to the PCB over a stripline-ready trace which transitions to microstrip before and after the SMT stripline part to maintain consistent characteristic impedance. When presented with a high isolation need between two cavities using microstrip transmission lines, the proposed stripline SMT apparatus under the isolation wall will tend to provide the necessary isolation. The present invention provides a repeatable and reliable interconnect while improving the electrical match between the two cavities. Furthermore, the invention removes the costs associated with manually forming and soldering cables between PCBs.

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Cameron Park, CA, United States of America

Jason Snodgress