International Business Machines Corporation

Apple Inc.

Jason Scott Miller

David Clifford Long

David L Edwards

Ronald L Hering

Raschid Jose Bezama

Randall Jason Werner

William Louis Brodsky

John G Torok

Jeffrey Allen Zitz

Sushumna Iruvanti

John Saunders Corbin, Jr

Kenneth Charles Marston

Glenn Graham Daves

Carl R Peterson

Paul F Bodenweber

Yuet-Ying Yu

Robert P Westerfield, Jr

John F Harmuth

William W Harkins

Benjamin Paul Tongue

Christopher E Pepe

John A Rudy

Ronald M Rothkranz

A system and method for simulating to one or more individual observers a view through a window using a display screen comprising a storage device containing in electronic form one or more images of a scene selected from the group consisting of one or more images of the scene at different angles and one or more images of the scene at different magnifications. A display screen is adapted to display the images to one or more individual observers, and a sensor is adapted to locate observers with respect to the display screen. A controller is adapted to select one or more of the images based on angle or distance of the individual observers with respect to the display screen and display the selected images on the display screen to simulate to the observers a view through a window of the scene.

Virtual window with simulated parallax and field of view change

An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip module by a land grid array (LGA) connector, a metal stiffener including a fluid-based pressure compensator contacting an underside of the PCB, and at least two couplers for coupling the metal stiffener to the chip module, with the PCB and the LGA connector therebetween. The fluid-based pressure compensator automatically compensates for natural and non-systematic out-of flatness tolerances of the PCB and the chip module, and non-uniform thickness of the PCB while creating a substantially uniform contact force on the LGA.

IC chip package having automated tolerance compensation

An electronic module and a method of assembling the electronic module. A circuit board is connected to a chip substrate by an array of connectors, and a base member is on the side of the circuit board away from the chip substrate and connector array. An elastomeric structure is placed between the circuit board and the base member. The elastomeric structure has voids between a first defining plane adjacent the circuit board and a second defining plane adjacent the base member, with the voids adapted to permit local deformation of elastomeric material in the structure. The method includes applying a compressive force between the circuit board and base member to at least partially compressing the elastomeric structure to improve load equalization on the circuit board.

Elastomer interposer with voids in a compressive loading system

A cam-action expanding standoff connector and related method are disclosed for mounting a circuit board. The standoff connector includes a body and a plurality of mounting members having interior longitudinally-extending camming portions for engagement by a cam. A cam is configured to be positioned within the mounting members in a first position in which the mounting members are not expanded against the interior of a mounting opening and in a second position in which the cam engages the camming portions to expand the plurality of mounting members against the interior of the mounting opening. Since the camming action is horizontal only (purely radial), practically no vertical forces are applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be established and maintained.

Circuit board cam-action standoff connector

A dispensing system for feeding paste through a screen onto a workpiece monitors the position of a piston applying pressure to the paste with a linear variable differential transformer and sets limits on the slope of the piston displacement is a measure of the feed rate and the 'spring back' of the piston when pressure is released, as a measure of trapped air in the system.

Real time usage monitor and method for detecting entrapped air

A flexible plate for securing a microchip surface to the surface of a cooling device. The flexible plate allows for z-directional movement between the microchip subassembly having a circuit board and a semiconductor substrate, and the cooling device. The flexible plate is a compact, single piece design that provides constraints in alignment in the x-, y-, and theta-directions, while allowing for z-direction compliance and tilt compliance. The flexible plate has tabs for mounting the microchip subassembly and tabs for mounting the cooling device. The microchip tabs are opposite one another and the cooling device mounting tabs are opposite one another. The flexible plate is a one-piece construction made from sheet metal, plastic, or metal castings. The flexible plate has a band with all the tabs mounted on the inside of the band, or one set of tabs mounted on the outside of the band.

Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip

A self-aligning socket for an integrated circuit package includes an outer frame and an array of contacts configured for alignment with corresponding conductive pads on the bottom of the integrated circuit package. The outer frame further includes a first plurality of alignment ball bearings configured thereon, the ball bearings mounted on cantilevered spring rods.

Apparatus for implementing a self-centering land grid array socket

A method and apparatus for the rapid cooling of screen masks used in the fabrication of semiconductor components is provided. The method and apparatus use a specially designed cooling plate which is contacted with a mask frame holding the screening mask. After a heated cleaning step which cleans the mask frame and screening mask of metal paste used in the screening operation, the cooling plate having one or more concave lower surfaces contacts the upper surfaces of the mask frame and bends the mask frame in the shape of the concave surfaces. This ensures intimate contact between the cooling plate and mask frame and enhances the thermal efficiency of the cooling step.

Method and apparatus for rapid cooling of metal screening masks

An expanding standoff connector is disclosed including a collar having a slit through a wall of the collar, a tapered interior surface and an exterior surface configured to engage an interior of a mounting opening of the circuit board. A fastener including a threaded portion and a substantially cone shaped portion configured to mate with the tapered interior surface of the collar is placed within the collar and advanced to expand the collar to mount the circuit board. A related method for mounting a circuit board is also disclosed. Since the expansion is horizontal only (purely radial), a more uniform radial expansion from top-to-bottom of the collar is applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be maintained.

Expandable standoff connector with slit collar and related method

An integrated circuit screen printing nozzle that has a nozzle body, a first inner layer on the nozzle body, a second outer layer on the first layer, and an opening through the nozzle body, the first layer, and the second layer. The first and second layers can be an insert held within the body. The opening allows paste material to flow through the screen printing nozzle to the stencil mask. Also, the second outer layer includes a contact surface adapted to contact the stencil mask. One feature of the invention is that the first layer is softer (has a lower durometer) than the second layer. This allows the second layer to be more durable than the first layer and for the first layer to provide additional flexibility to the second layer. Therefore, the invention provides a nozzle that has the high durability characteristics of a hard outer surface with the compliance of a soft nozzle.

Dual-layer compliant polymeric nozzle

An apparatus in which opposed nozzle assemblies are utilized to clean residual material, such as a metallic paste, from an article, such as a screening mask. Each of the nozzle assemblies has a first set of nozzles for spraying a cleaning agent onto the article in a first pattern to first chemically and mechanically remove residual material from the article. At least one of the nozzle assemblies has a second set of nozzles for spraying a cleaning agent onto the article in a second pattern while simultaneously applying a voltage between the second set of nozzles and the article to then chemically and electrolytically remove the remaining residual material from the article.

Growing community of inventors

Poughkeepsie, NY, United States of America

Jason Scott Miller