Apple Inc.

Other

Jason S Pelc

Mark Alan Arbore

Alfredo Bismuto

Michael J Bishop

Matthew Austin Terrel

Vijay M Iyer

Thomas Charles Greening

David I Simon

Andrea Trita

Yi-Kuei Ryan Wu

Mohamed Mahmoud

Hooman Abediasl

Yongming Tu

Mario J Costello

Alex Goldis

Alexander Shpunt

David S Gere

Andrew J Sutton

Igal I Bayn

Peter Chang

Huiyang Deng

Lexie Nicole Schachne

Pat Wright

Peter L D Chang

Arun Kumar Subramanian

Patrick B Wright

Jin-Hyoung Lee

Satyarth Suri

Alexander F Sugarbaker

Disclosed herein is an integrated photonics device including an on-chip wavelength stability monitor. The wavelength stability monitor may include one or more interferometric components, such as Mach-Zehnder interferometers and can be configured to select among the output signals from the interferometric components for monitoring the wavelength emitted by a corresponding photonic component, such as a light source. The selection may be based on a slope of the output signal and in some examples may correspond to a working zone at or around a wavelength or wavelength range. In some examples, the interferometric components can be configured with different phase differences such that the corresponding working zones have different wavelengths. In some examples, the slopes of the output signals may be weighted based on the steepness of the slope and all of the output signals may include information for wavelength locking the measured wavelength to the target wavelength.

Mach-Zehnder interferometer device for wavelength locking

Configurations for an optical coupler that includes waveguides that provide asymmetric mode confinement. The optical coupler may include first and second rib waveguides, and the width of the shoulder of at least one rib waveguide may taper to provide the asymmetric mode confinement. In some instances the shoulders of one or both rib waveguides may have different heights in a central region of the optical coupler.

Compact optical coupler

Configurations for a modal interference device used for wavelength locking are disclosed. The modal interference device may be an interference device that includes an input waveguide, an interference waveguide, and an output waveguide. A fundamental mode of light may be launched into the input waveguide and the interference waveguide may receive the fundamental mode and generate a higher order mode of light, where the two modes of light may be superimposed while propagating through the interference waveguide. The two modes of light may be received at an output waveguide that collapses the two modes into a single mode and generates an output signal corresponding to the interference between the two modes of light. The output signal may be used to wavelength lock a measured wavelength to a target wavelength. The multiple output waveguides may produce output signals that have dead zones that do not align with one another for any wavelength in the wavelength range of interest.

Interference devices for wavelength locking

Anti-reflective optical structures are disclosed. The anti-reflective optical structures include sub-wavelength structures in order to produce one or more index of refraction gradients within the anti-reflective optical structures. The one or more index of refraction gradients can reduce reflection of light over a broad band of wavelengths.

Anti-reflective optical structures for optical systems

Described here are optical sampling architectures and methods for operation thereof. An optical sampling architecture can be capable of emitting a launch sheet light beam towards a launch region and receiving a detection sheet light beam from a detection region. The launch region can have one dimension that is elongated relative to another dimension. The detection region can also have one dimension elongated relative to another dimension such that the system can selectively accept light having one or more properties (e.g., angle of incidence, beam size, beam shape, etc.). In some examples, the elongated dimension of the detection region can be greater than the elongated dimension of the launch region. In some examples, the system can include an outcoupler array and associated components for creating a launch sheet light beam having light rays with different in-plane launch positions and/or in-plane launch angles.

Resolve path optical sampling architectures

A device including a plurality of epitaxial chips is disclosed. An epitaxial chip can have one or more of a light source and a detector, where the detector can be configured to measure the optical properties of the light emitted by a light source. In some examples, one or more epitaxial chips can have one or more optical properties that differ from other epitaxial chips. The epitaxial chips can be dependently operable. For example, the detector located on one epitaxial chip can be configured for measuring the optical properties of light emitted by a light source located on another epitaxial chip by way of one or more optical signals. The collection of epitaxial chips can also allow detection of a plurality of laser outputs, where two or more epitaxial chips can have different material and/or optical properties.

Connected epitaxial optical sensing systems

This disclosure relates to the layout of optical components included in a photonics integrated circuit (PIC) and the routing of optical traces between the optical components. The optical components can include light sources, a detector array, and a combiner. The optical components can be located in different regions of a substrate of the PIC, where the regions may include one or more types of active optical components, but also may exclude other types of active optical components. The optical traces can include a first plurality of optical traces for routing signals between light sources and a detector array, where the first plurality of optical traces can be located in an outer region of the substrate. The optical traces can also include a second plurality of optical traces for routing signals between the light sources and a combiner, where the second plurality of optical traces can be located in regions between banks of the light sources.

Photonics integrated circuit architecture

Embodiments are directed to optical measurement systems that utilize multiple emitters to emit light during a measurement, as well as methods of performing measurements using these optical measurement systems. The optical measurement systems may include a light generation assembly that is configured to generate light via a light source unit, and a photonic integrated circuit that includes a launch group having a plurality of emitters. Each of these emitters is optically coupled to the light generation assembly to receive light generated from the light generation assembly, and may emit this light from a surface of the photonic integrated circuit. The optical measurement system may perform a measurement in which the light generation assembly generates light and each of the plurality of emitters simultaneously emit light received from the light generation assembly.

Despeckling in optical measurement systems

Described herein is an integrated photonics device including a light emitter, integrated edge outcoupler(s), optics, and a detector array. The device can include a hermetically sealed enclosure. The hermetic seal can reduce the amount of moisture and/or contamination that may affect the measurement, analysis, and/or the function of the individual components within the sealed enclosure. Additionally or alternatively, the hermetic seal can be used to protect the components within the enclosure from environmental contamination induced during the manufacturing, packaging, and/or shipping process. The outcoupler(s) can be formed by creating one or more pockets in the layers of a die. Outcoupler material can be formed in the pocket and, optionally, subsequent layers can be deposited on top. The edge of the die can be polished until a targeted polish plane is achieved. Once the outcoupler is formed, the die can be flipped over and other components can be formed.

Integrated photonics device having integrated edge outcouplers

Described herein are one or more methods for integrating an optical component into an integrated photonics device. The die including a light source, an outcoupler, or both, may be bonded to a wafer having a cavity. The die can be encapsulated using an insulating material, such as an overmold, that surrounds its edges. Another (or the same) insulating material can surround conductive posts. Portions of the die, the overmold, and optionally, the conductive posts can be removed using a grinding and polishing process to create a planar top surface. The planar top surface enables flip-chip bonding and an improved connection to a heat sink. The process can continue with forming one or more additional conductive layers and/or insulating layers and electrically connecting the p-side and n-side contacts of the laser to a source.

Laser integration techniques

Connected epitaxial optical sensing system comprising a trench deeper than a waveguide of a light source electrically isolates the light source and a detector

An integrated photonics device that emits light out towards a measured sample value is disclosed. The device can include a discrete optical unit that attaches to a supporting layer. The discrete optical unit can include mirror(s), optics, detector array(s), and traces. The supporting layer can include one or more cavities having facet walls. Light emitter(s) can emit light that propagate through waveguide(s). The emitted light can exit the waveguide(s) (via termination point(s)), enter the one or more cavities at the facet walls, and be received by receiving facets of the discrete optical unit. The mirror(s) of the discrete optical unit can redirect the received light towards collimating optics, which can direct the light out of the device through the system interface. The discrete optical unit can be formed separately from the supporting layer or bonded to the supporting layer after the mirror, optics, detector arrays, and traces are formed.

Discrete optical unit on a substrate of an integrated photonics chip

Configurations for a photonics device with a vertical outcoupler and fabrication operations thereof are disclosed. The photonics device may include an off-cut substrate with a cavity. The cavity may be coated with a buffer layer, which may form the vertical outcoupler. The cavity may be filled with a fill material that provides structural integrity to the cavity. The off-cut substrate may have a first and a second cladding layer above and below it, to provide cladding for the waveguide structure. In some examples, light may propagate through the off-cut substrate and may be received by the outcoupler. The outcoupler may reflect and redirect the light out of the waveguide structure and toward one or more optical elements. The optical element(s) may provide the light to a launch region in a system interface and/or to a sample.

Growing community of inventors

Sunnyvale, CA, United States of America

Jason S Pelc