Rohm & Haas Electronic Materials LLC

Xtalic Corporation

Jason Reese

James A Curran

Evgeniya Freydina

James A Wright

Alan C Lund

Gary Hamm

Joshua Garth Abbott

Shiyun Ruan

Robert Daniel Hilty

Lisa J Chan

Luis A Gomez

Techniques for forming an enclosure comprised of an aluminum alloy are disclosed. In some embodiments, aluminum ions and metal element ions can be dissolved in a non-aqueous ionic liquid in an electrolytic plating bath. A reverse pulsed electric current can facilitate in co-depositing the aluminum ions and the metal element ions onto a metal substrate. The resulting aluminum alloy layer can include nanocrystalline structures, which can impart the alloy layer with increased hardness and increased resistance to scratching, corrosion, and abrasion. In some embodiments, the metal element ion is chromium and the aluminum alloy layer includes a chromium oxide passivation layer formed via a passivation process. Subsequent to the passivation process, the formation of the chromium oxide layer does not impart a change in color to the aluminum alloy layer. In some embodiments, hafnium ions are co-deposited with aluminum ions to form an aluminum hafnium alloy.

Nanostructured aluminum alloys for improved hardness

Techniques for forming an enclosure comprised of aluminum zirconium alloy layer are disclosed. In some embodiments, aluminum ions and zirconium ions can be dissolved in a non-aqueous ionic liquid in an electrolytic plating bath. A reverse pulsed electric current can facilitate in co-depositing the aluminum ions and the zirconium ions onto a metal substrate. The resulting aluminum zirconium alloy layer can include nanocrystalline grain structures, which can impart the alloy layer with increased hardness and increased resistance to scratching, denting, and abrasion. In some embodiments, the aluminum zirconium alloy layer can be anodized to form an aluminum oxide layer. Subsequent to the anodization operation, the oxidized layer is able to retain its substantially neutral color.

Nanostructured aluminum zirconium alloys for improved anodization

Semiconductors are electrochemically etched in solutions containing sources of bifluoride and nickel ions. The electrochemical etching may form pores in the surface of the semiconductor in the nanometer range. The etched semiconductor is then nickel plated.

Electrochemical etching of semiconductors

Methods are provided for manufacturing optical display devices which remove an etch resist and residual post-etch metal in a single step. These methods are particularly useful in the manufacture of LCDs.

Stripping method

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Londonderry, NH, United States of America

Jason Reese