Semiconductor Components Industries, LLC

Plasma-therm, Inc.

Jason Michael Doub

Gordon M Grivna

Russell Westerman

Linnell Martinez

David Pays-Volard

Rich Gauldin

Dwarakanath Geerpuram

Ken Mackenzie

Thierry Lazerand

In one embodiment, semiconductor die are singulated from a semiconductor wafer by placing the semiconductor wafer onto a carrier tape, forming singulation lines through the semiconductor wafer, and reducing the presence of residual contaminates on the semiconductor wafer.

Method of reducing residual contamination in singulated semiconductor die

The present invention provides a method for plasma dicing a substrate. The method comprising: providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate on a carrier support to form a work piece; providing an intermediate ring interposed between the substrate and the frame; loading the work piece onto the work piece support; generating a plasma through the plasma source; and etching the work piece through the generated plasma.

Method and apparatus for plasma dicing a semi-conductor wafer

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Pocatello, ID, United States of America

Jason Michael Doub