Cts Corporation

Jason Langhorn

Craig N Ernsberger

Patrick B Blakesley

Robert R Rainey

Yinggang Tu

An R-C network formed on a substrate. The capacitor includes a metal member with anodized and unanodized layers. The unanodized layer functions as one of the capacitor's electrodes. The anodized layer functions as the capacitor's dielectric layer. The resistor is formed from material on the same side of the substrate as the capacitor. In some versions of the invention, the resistor is formed on top of a substrate dielectric layer. In these versions of the invention, a conductor both functions as one of the capacitor's electrodes and connects the resistor to the capacitor. In alternative versions of the invention, the resistor is formed from a film that disposed on the undersurface a metal foil. The foil functions as the resistor to capacitor conductor. Sections of the foil that are removed expose and define the resistor. Solder balls or other connectors on the substrate surface connect the network to another component.

Ball grid array resistor capacitor network

A pressure sensor for sensing a pressure level of a pressurized medium. The pressure sensor includes a housing that has a high pressure side, a low pressure side and an aperture. A substrate is located in the aperture. The substrate has a pair of ends and a center portion. The center portion is brazed to the housing in the aperture. The center portion seals the high pressure side from the low pressure side. A pressure sensitive resistor is mounted to one end of the substrate. A reference resistor is mounted to another end of the substrate. A circuit line is located on the substrate. The circuit line is connected between the pressure sensitive resistor and the reference resistor.

Pressure sensor

A pressure sensor for sensing a pressure level of a pressurized medium. In one embodiment, the pressure sensor has a high pressure side and a low pressure side. An aperture may extend through at least a portion of the sensor assembly, and a seal is located in the aperture. The seal seals the high pressure side from the low pressure side. Electrical leads extend through the seal between the high pressure side and the low pressure side. A substrate is located on the high pressure side. A pressure sensitive resistor is mounted on the substrate such that the resistor is directly exposed to the pressurized medium. The resistor changes resistance in response to a change in pressure. The resistor is connected to the electrical leads.

A hermetic multi-layered ceramic semiconductor package for micro-machined semiconductor devices. The package has a substrate with top and bottom surfaces. A micro-machined semiconductor device is located adjacent to the top surface. Vias extend through the substrate between the surfaces. The micro-machined semiconductor device is electrically connected to the vias. A rigid support is located between the micro-machined semiconductor device and the top surface to support the micro-machined semiconductor device during assembly and to space the micro-machined semiconductor device from the top surface. Solder spheres are mounted to the bottom surface and are connected to the vias.

Micro-machined semiconductor package

A ball grid array resistor network has a planar substrate formed of an organic material. The substrate preferably is a printed circuit board. The substrate has a top and bottom surface. A ball pad is located on the bottom surface. A low temperature resistor is located on the bottom surface and is connected to the ball pad. A solder mask is located over the first surface except for the ball pads. A conductive ball is attached to the ball pad. A reflowed solder paste connects the conductive ball to the ball pad. Several embodiments of the invention are shown.

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South Bend, IN, United States of America

Jason Langhorn