Laird Technologies Gmbh

Thermagon, Inc.

Other

Jason L Strader

Richard F Hill

Mark D Kittel

Eugene Anthony Pruss

Keith David Johnson

Michael S Wladyka

Jingting Yang

Karen Bruzda

Mark Wisniewski

Gerald Robert English

John Song

Hoang Dinh Do

Robert Howard Boutier, Jr

Michael D Craig

Kevin Joel Bohrer

Michael S Plante

Douglas S McBain

Michael Scott Poulsen

Joseph C Boetto

Sri Talpallikar

Leonid Lev Shmagin

Woongho Bang

Björn Edgren

Karl Göran Olof Ihrefjord

Matthew Tapping

James Latham

Kyle Burke Huffstutler

Eric Edward Trantina

Jr Robert Howard Boutier

Edging for materials

According to various aspects, exemplary embodiments are disclosed of thermally-conductive EMI absorbers that generally includes thermally-conductive particles, EMI absorbing particles, and silicon carbide. The silicon carbide is present in an amount sufficient to synergistically enhance thermal conductivity and/or EMI absorption. By way of example, an exemplary embodiment of a thermally-conductive EMI absorber may include silicon carbide, magnetic flakes, manganese zinc ferrite, alumina, and carbonyl iron.

Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide

Disclosed are exemplary embodiments of thermally-conductive electromagnetic interference (EMI) absorbers including aluminum powder.

Thermally-conductive electromagnetic interference (EMI) absorbers including aluminum powder

A system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component. The tool may include a resilient material configured for tamping the portion of the material onto the component and imprinting the portion of the material for release and transfer from the supply.

Systems of applying materials to components

Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.

Thermal management and/or EMI mitigation materials including coated fillers

According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.

Methods for establishing thermal joints between heat spreaders or lids and heat sources

Material having edging

Material having edge shape

Disclosed herein are thermal interface materials (TIMs) including memory foam cores. In an exemplary embodiment, a thermal interface material generally includes a memory foam core including a plurality of sides defining a perimeter. A heat spreader is disposed at least partially around the perimeter defined by the plurality of sides of the memory foam core.

Thermal interface materials including memory foam cores

A system for applying thermal interface materials to components includes a supply of thermal interface material and a die. The die is operable for pushing against and/or removing a portion of the thermal interface material that is between the die and a corresponding one of the components. The portion of the thermal interface material is removed from the supply and applied to the corresponding one of the components.

System for applying interface materials

A device for absorbing energy from an electronic component includes a low melting alloy layer including a first side and a second side opposing the first side, and coating layers substantially covering the first side and the second side of the low melting alloy layer. In some embodiments, the low melting alloy layer includes a polymer mixture and a plurality of low melting alloy particulates dispersed in the polymer mixture. Other example devices are also disclosed.

Devices for absorbing energy from electronic components

Growing community of inventors

Cleveland, OH, United States of America

Jason L Strader