Kla Tencor Corporation

Jason Keith Rowan

Li-Min Chen

Roni Robinzon

Christopher Vreje Ohanian

One embodiment relates to an apparatus for vacuum-compatible substrate thermal management. The apparatus includes a load-lock chamber coupled to a vacuum chamber, a light-emitting diode array, and a substrate stage. The load-lock chamber is configured to hold a substrate prior to the substrate being transferred into the vacuum chamber, and a substrate stage is configured to hold the substrate in the vacuum chamber. The light-emitting diode array is configured to warm the substrate while the substrate is in the load-lock chamber. Other features, aspects and embodiments are also disclosed.

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San Jose, CA, United States of America

Jason Keith Rowan