Jds Uniphase Corporation

Jason Jiazhan Xu

Karl M Kissa

Glen Drake

William J Minford

Marc K Von Gunten

Charles Andrew Hulse

Benjamin F Catching

Daniel Lynch

Jerry Zieba

Xingfu Chen

Donald M Friedrich

Jason Reed

Hiren V Shah

Walter R Bosenberg

Julia Duncan

Nelson Mark

Lawrence Brodsky

John Clark

The invention relates to an electro-optic modulator structure containing an additional set of bias electrodes buried within the device for applying bias to set the operating point. Thus the RF electrodes used to modulate incoming optical signals can be operated with zero DC bias, reducing electrode corrosion by electro-migration and other effects that can be present in non-hermetic packages. The bias electrodes include an upper split portion and an optically transparent lower portion. The optically transparent lower layer improves modulation frequency and reduces optical loss.

Humidity tolerant electro-optic device

The invention relates to a wafer scale process for the manufacture of optical waveguide devices, and particularly for the manufacture of ridge waveguide devices, and the improved waveguides made thereby. The present invention has found a process for achieving sub-micron control of an optical waveguiding layer thickness by providing a dimensionally stable wafer assembly into which adhesive can be introduced without altering the planar relationship between a carrier wafer and an optically transmissive wafer in wafer scale manufacture. This process permits wafer scale manufacture of optical waveguide devices including thin optically transmissive layers. A pattern of spacer pedestals is created by a deposition and etch back, or by a surface etch process to precisely reference surface information from a master surface to a carrier wafer to a thin optically transmissive wafer. The tolerance achievable in accordance with this process provides consistent yield across the wafer.

Wafer scale method of manufacturing optical waveguide devices and the waveguide devices made thereby

An electrode structure wherein galvanic corrosion at adhesion layers formed between electrodes and electronic or electro-optic substrates is eliminated. The electrode structure includes an electro-optic crystalline substrate, an amorphous layer disposed on the crystalline substrate, the amorphous layer having a composition substantially similar to a composition of the crystalline substrate, and a gold layer disposed directly on the amorphous layer. The amorphous layer is created using ion sputtering etching techniques that clean and activate the surface of the crystalline substrate such that the gold layer is able to adhere to it.

Adherent all-gold electrode structure for lithium niobate based devices and the method of fabrication

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Weatogue, CT, United States of America

Jason Jiazhan Xu