Tyco Electronics Corporation

Americas Styrenics, LLC

Jason J Miller

Edward John Bright

Michael Warren Fogg

Gary C Welsh

Jason R Vititoe

Kai Goellner

Daron J Kleppe

A phase change thermal storage unit having has at least one conformational feature selected from (i) a fill port located proximate a corner of the of the panel, (ii) internal contouring that alters the thickness of the phase change material retention chamber for creating an average thickness of the chamber within a central portion of the chamber which is less than the average thickness of the chamber within a peripheral portion of the chamber, and (iii) fingertip indentation handles proximate each and every edge.

Phase change material panel and passive thermally controlled shipping container employing the panels

The extensional viscosity of a styrenic resin is enhanced by increasing the Z+1 average molecular weight (Mz+1) of the resin. In one embodiment, an enhanced extensional viscosity resin is provided that has an Mz+1 molecular weight of at least approximately 745,000 and an extensional viscosity having a minimum value of approximately 360,000 Pascal-seconds (Pa-sec).

Styrenic resin having improved extensional viscosity

A heat sink and light pipe assembly is provided for an electronic module configured to be mounted on a circuit board. The assembly includes a bracket configured to be held proximate the electronic module. The bracket includes a light pipe mounting post and the bracket defines an opening therein. A heat sink includes a base having a portion configured to extend through the opening in the bracket to engage the electronic module. A light pipe is held in the light pipe mounting post. The light pipe is configured to convey a status of the electronic module.

Integrated heat sink and light pipe mounting assembly

An electrical module assembly is provided that is configured for latching engagement with a receptacle assembly. The module assembly comprises a module housing having an exterior envelope and an interior cavity. The exterior envelope of the module housing is configured to be plugged into the receptacle assembly. A release mechanism is joined to the module housing. The release mechanism is moveable between locked and unlocked positions. The release mechanism is configured to unlock the module housing from the receptacle assembly when the release mechanism is moved from the locked position to the unlocked position. A detection switch is located within the interior cavity of the module housing. The detection switch monitors a position of the release mechanism and provides latched and unlatched state signals based on the position of the release mechanism. The latched state signal indicates that the module housing is locked in the receptacle assembly. The unlatched state signal indicates that the release mechanism is being moved to the unlocked position.

Growing community of inventors

Tower City, PA, United States of America

Jason J Miller