Applied Materials, Inc.

Jason Garcheung Fung

Daniel Redfield

Rajeev Bajaj

Mayu Felicia Yamamura

Mahendra Christopher Orilall

Gregory E Menk

Hou Tee Ng

Ashwin Chockalingam

Nag B Patibandla

Fred Conrad Redeker

Boyi Fu

Aniruddh Jagdish Khanna

Robert E Davenport

Kasiraman Krishnan

Veera Raghava Reddy Kakireddy

Russell Edward Perry

Sivapackia Ganapathiappan

Mario Dagio Cornejo

Hung Chih Chen

Shou-Sung Chang

Charles C Garretson

Sivakumar Dhandapani

Ashavani Kumar

Venkat Hariharan

Amritanshu Sinha

Puneet Narendra Jawali

Nandan Baradanahalli Kenchappa

Stan D Tsai

Thomas H Osterheld

Paul D Butterfield

Eric Lau

Sameer Deshpande

Christopher Cocca

Adam Wade Manzonie

Shiyan Akalanka Jayanath Wewala Gonnagahadeniyage

John Watkins

Jeonghoon Oh

Jun Qian

Jay Gurusamy

Jimin Zhang

Daxin Mao

Edwin C Suarez

William H McClintock

King Yi Heung

Andrew Scott Lawing

Douglas Kitajima

Igor Abramson

Mo Yang

Matthew A Gallelli

Kevin Chou

Joonho An

Jaeseok Kim

Raghava Kakireddy

Rob Davenport

Venkatachalam Hariharan

A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.

Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

Techniques for combining CMP process tracking data with 3D printed CMP consumables

Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

CMP pad construction with composite material properties using additive manufacturing processes

Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post includes an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface. The sidewalls of the plurality of individual posts define a plurality of pores disposed between the posts.

Polishing pads with interconnected pores

Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.

Polishing pads having selectively arranged porosity

Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.

Advanced polishing pads and related polishing pad manufacturing methods

Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process

Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process

Embodiments of the present disclosure generally relate to droplet ejecting additive manufacturing systems used in the manufacturing of advanced polishing articles. In particular, embodiments herein provide methods for aligning a plurality of dispense heads of the additive manufacturing system. In one embodiment, a method for aligning a plurality of dispense heads of an additive manufacturing system includes forming an alignment test pattern comprising droplets dispensed from each of the plurality of dispense heads, comparing the placement of one or more of the droplets to determine offset distances therebetween, and generating one or more timing offsets based on the offset distances. In some embodiments, the method further includes using the timing offsets to control the dispensing of droplets from one or more of the plurality of dispense heads in a subsequent additive manufacturing process.

Multi dispense head alignment using image processing

Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

Polishing pads produced by an additive manufacturing process

A method of fabricating a polishing pad using an additive manufacturing system includes depositing a first set successive layers by droplet ejection to form a. Depositing the successive layers includes dispensing a polishing pad precursor to first regions corresponding to partitions of the polishing pad and dispensing a sacrificial material to second regions corresponding to grooves of the polishing pad. Removing the sacrificial material provides the polishing pad with a polishing surface that has the partitions separated by the grooves.

Using sacrificial material in additive manufacturing of polishing pads

A method of fabricating an object using an additive manufacturing system includes receiving data indicative of a desired shape of the object to be fabricated by droplet ejection. The desired shape defines a profile including a top surface and one or more recesses. Data indicative of a pattern of dispensing feed material is generated to at least partially compensate for distortions of the profile caused by the additive manufacturing system, and a plurality of layers of the feed material are dispensed by droplet ejection in accordance to the pattern.

Correction of fabricated shapes in additive manufacturing

An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to hold a conditioning disk against the polishing surface, an in-situ polishing pad thickness monitoring system, and a controller. The controller is configured to store data associating each of a plurality of conditioner disk products with a respective threshold value, receive an input selecting a conditioner disk product from the plurality of conditioner disk products, determine a particular threshold value associated with the selected conditioner disk product, receive a signal from the monitoring system, generate a measure of a pad cut rate from the signal, and generate an alert if the pad cut rate falls beyond the particular threshold value.

Pad conditioner cut rate monitoring

Embodiments disclosed herein provide methods of forming bond pad redistribution layers (RDLs) in a fan-out wafer level packaging (FOWLP) scheme using an additive manufacturing process. In one embodiment, a method of forming a redistribution layer includes positioning a carrier substrate on a manufacturing support of an additive manufacturing system, the carrier substrate including a plurality of singulated devices, detecting one or more fiducial features corresponding to each of the plurality of singulated devices, determining actual positions of each of the plurality of singulated devices relative to one or more components of the additive manufacturing system, generating printing instructions for forming a patterned dielectric layer based on the actual positions of each of the plurality of singulated devices, and forming the patterned dielectric layer using the printing instructions.

Integrating 3D printing into multi-process fabrication schemes

A method of fabricating a polishing pad using an additive manufacturing system includes receiving data indicative of a desired shape of the polishing pad to be fabricated by droplet ejection. The desired shape defines a profile including a polishing surface and one or more grooves on the polishing pad. Data indicative of a modified pattern of dispensing feed material is generated to at least partially compensate for distortions of the profile caused by the additive manufacturing system, and a plurality of layers of the feed material are dispensed by droplet ejection in accordance to the modified pattern.

Growing community of inventors

Santa Clara, CA, United States of America

Jason Garcheung Fung