Microsoft Technology Licensing, LLC

Jason Fergus Lee

Kenneth S Reneris

James Michael Bonicatto

Kenneth Charles Boman

Matus Lipka

Michael Burt Goulding

Gregory Scott Yoder

Jamie Randall Kuesel

Paige Frederick

Randall J Park

Embodiments of the present disclosure provide systems and methods to determine an inductance for each of a plurality of inductors of a superconducting circuit. The plurality of inductors are routed between a plurality of superconducting devices. An amount of coupled flux between inductors of the plurality of inductors is determined. Inductor widths along portions of the plurality of inductors are adjusted based on the inductance, the amount of coupled flux, and inductance requirements of the superconducting devices.

Inductor tuning in superconducting circuits

The present disclosure relates to routing superconducting wires in superconducting circuits and in particular to efficiently routing superconducting wires that meet inductance requirements. The superconducting wire routing technique involves modeling the target location not only as a physical location, but as a physical location (e.g., x, y, and z dimensions) combined with inductance (e.g., a target inductance range). One or more other constraints may also be included in the modeling, such as a number of wires that would need to be moved/lifted, a number of circuit-vias allowing passage through layers of the circuit, an amount of cross-coupling with other inductors, and a number of wire segments.

Routing of superconducting wires

Examples are disclosed that relate to aligning a pressure sensitive adhesive to a body of a display device for attachment of a display module to the display device. One example provides an electronic display device comprising a body, the body comprising a wall and a deck extending inwardly from the wall. The deck comprises a first reference feature configured to interface with a first index feature on a pressure sensitive adhesive application fixture, and a second reference feature configured to interface with a second index feature on the pressure sensitive adhesive application fixture. The electronic display device further comprises a display module supported by the deck, and a pressure sensitive adhesive adhering the display module to the deck.

Placement of adhesive in display device

Computing devices may require disassembly to repair or replace a defective or damaged component, or to facilitate recycling at the end of the computing device's service life. While pressure sensitive adhesive (PSA) is good at creating secure connections between components within the expected operating conditions of the computing device, PSA resists intentional disassembly of such components. The presently disclosed PSA with thermally conductive release tabs provides a mechanism for effective spot-cooling of the PSA between adhered components. Once the PSA reaches a low temperature threshold, one component may be mechanically separated from another component. This yields potentially faster and easier disassembly of adhered components than prior art techniques.

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Redmond, WA, United States of America

Jason Fergus Lee