International Business Machines Corporation

Lenovo (singapore) Pte. Ltd.

Jason E Minyard

Aaron Roger Cox

Joni E Saylor

Camillo Sassano

William J Grady

Jason Aaron Matteson

Kevin Lavern Schultz

Ronald A Smith

Roland N Zapfe

Paula Besterman

Lei R Li

William J Grady, Iv

Michael Raymond Miller

Howard P Welz

ZhenDe Fu

Gerard Frances Muenkel

Sean M Ackley

Robert K Mullady

Vinod Kamath

Jeffrey John Smith

Zhen De Fu

Identification of a material composition. The material composition is configured with a sequential pattern applied to one or more surfaces of the body. The sequential pattern identifies the specific material composition. A discrete section or sub-section of the material is analyzed, after which the discrete section or sub-section may be sorted for recycling.

Identification of material composition

A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.

Cooling methods for electronic components

A tool-less heat spreader for dissipating heat produced by an electrical computing component includes a first clamp member having a first component interface end and an opposite, first lever end; and a second clamp member having a second component interface end and an opposite, second lever end; where the first clamp member and the second clamp member are biasedly coupled to one another and such movement of at least one of the first lever end and the second lever end at least partially overcomes the bias and moves the first and second component interface ends away from one another.

Tool-less and reusable heat spreader

A tool-less heat spreader for dissipating heat produced by an electrical computing component includes a first section having a flexible thermal interface material for engaging either side of the electrical computing component; and a rigid heat shield pivotally connected to the first section, the rigid heat shield pivoting between one of a first position and a second position.

A structure of a server rack and sidecar combination. The structure may include; a server rack having an opening and a server door on a front side of the server rack; a sidecar mounted to a side of the server rack, the sidecar has an access area on a front side of the sidecar, wherein the server rack opening and the access area are accessible form a common side; an adapter mounted to the accessible common side, wherein the adapter does not restrict access to the server rack opening and the access area, the adapter has at least three vertical sides; and a cable management bar located within the at least three vertical sides.

Rack sidecar for additional IT equipment and cable management

A rack system for mounting a plurality of computing components includes an inner cabinet, and an outer cabinet adjustably coupled to the inner cabinet. The outer cabinet is selectively movable laterally over the inner cabinet to promote flexibility in configuring the plurality of computing components within the inner cabinet in three dimensional space.

Adjustable computing component rack

A memory module cooling system includes a liquid cooled manifold assembly and a heat spreader assembly rotateably attached to the liquid cooled manifold assembly about an axis perpendicular to the memory module. The liquid cooled manifold assembly includes a manifold, an liquid inlet, and a liquid outlet. The heat spreader assembly includes a base in thermal contact with a heat pipe, and a heat spreader in thermal contact with the heat pipe, the heat spreader configured to thermally engage the memory module. In certain embodiments, thermal bonds are maintained between a plurality of neighboring memory modules when a particular heat spreader assembly is rotated away from an associated memory module.

Orthogonally hinged individualized memory module cooling

Enclosure design panel

A system includes a support rack and a component housing. The support rack includes a pair of vertically-extending panels, and each panel of the pair of vertically-extending panels has one or more first mating members of a water coupler pair extending outwardly from the support rack. The component housing is slidably disposed between the pair of vertically-extending panels and has a front panel, a pair of sidewalls extending rearwardly from the front panel, a component water line, and two second mating members of the water coupler pair connected to each other by the component water line.

System for mounting and cooling a computer component

A mount for mounting a door to rack includes a rack including a first pair of vertically-extending supports, each support including an array of openings; a first mount coupled to the rack at a first position thereon, the first mount including: a first plate extending between the first pair of vertically-extending supports and including a first end and a second end, and a first hinge arm adjustably coupled with the first plate; a second mount coupled to the rack at a second position located below the first position, the second mount including: a second plate extending between the first pair of vertically-extending supports and including a first end and a second end, and a second hinge arm adjustably coupled with the second plate.

Universal system for mounting rack doors

Cooling system for electronics

An electronic device includes an opening in a cover, a sleeve extending from the opening to a circuit board, and a CPU assembly. The CPU assembly includes a CPU carrier and is insertable into the sleeve to connect the CPU carrier with a CPU connector upon the circuit board. A method of installing the CPU assembly into the electronic device includes inserting the CPU assembly into a an opening in a cover of the electronic device within a sleeve extending from the opening to a circuit board. A serviceable CPU assembly includes a CPU carrier thermally connected to an underside of a lower portion of a heat sink, a CPU assembly base including a plurality of guidance features to properly align CPU assembly during installation, and a handle assembly comprising at least one handle connected to an upper portion of the heat sink.

Growing community of inventors

Phoenix, AZ, United States of America

Jason E Minyard