Applied Materials, Inc.

Jason Della Rosa

Hamid Noorbakhsh

Vijay D Parkhe

Douglas A Buchberger, Jr

Ajit Balakrishna

Konstantin Makhratchev

Sergio Fukuda Shoji

Jong Mun Kim

Brad L Mays

A substrate support assembly includes a ceramic puck and a thermally conductive base having an upper surface that is bonded to a lower surface of the ceramic puck. Trenches are formed in the thermally conductive base approximately concentric around a center of the thermally conductive base. The trenches extend from the upper surface towards a lower surface of the thermally conductive base without contacting the lower surface of the thermally conductive base. The thermally conductive base includes thermal zones. The substrate support assembly further includes a thermally insulating material disposed in the trenches. The thermally insulating material in a trench of the trenches provides a degree of thermal isolation between two of the thermal zones separated by the trench at the upper surface of the thermally conductive base.

Electrostatic chuck having thermally isolated zones with minimal crosstalk

Embodiments of the present invention provide apparatus and methods for reducing non-uniformity and/or skews during substrate processing. One embodiment of the present invention provides a flow equalizer assembly for disposing between a vacuum port and a processing volume in a processing chamber. The flow equalizing assembly includes a first plate having at least one first opening, and a second plate having two or more second openings. The first and second plates define a flow redistributing volume therebetween, and the at least one first opening and the two or more second openings are staggered.

Recursive pumping for symmetrical gas exhaust to control critical dimension uniformity in plasma reactors

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Campbell, CA, United States of America

Jason Della Rosa