Ge Precision Healthcare LLC

General Electric Company

Jason Barrett

Flavien Daloz

Edouard Dacruz

Edouard Da Cruz

Jean Pierre Malacrida

Jessica Abraham

Various methods and systems are provided for a multi-frequency transducer array. In one example, ground recovery in the transducer array is enabled by configuring an acoustic stack of the transducer array with an interdigitated structure, a top layer coupled to a front side of the interdigitated structure, and a bottom layer coupled to a back side of the interdigitated structure, where the top layer and the bottom is electrically continuous with the interdigitated structure.

Methods and systems for ground recover in a transducer array

Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array includes an element formed of one or more sub-elements, at least one sub-element having a different resonance frequency. A frequency range of the transducer array may thereby be broadened.

Methods and systems for a multi-frequency transducer array

A method for making ultrasound transducers and ultrasound probes includes providing a piezoelectric layer having a first surface and a second surface, where the second surface is on an opposite side of the piezoelectric layer from the first surface. The method includes fabricating a plurality of conductive through vias extending from the first surface to the second surface of the piezoelectric layer, where fabricating the plurality of conductive through vias comprises cutting a plurality of trenches through the piezoelectric layer and filling each of the plurality of trenches with a conductive material. The method includes cutting the piezoelectric layer into a plurality of transducer units after fabricating the plurality of conductive through vias and cutting each of the transducer units into a plurality of transducer elements.

Method for manufacturing an ultrasound transducer and ultrasound probe

Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises a front face, a back face parallel to the front face, a piezoelectric layer having a top surface electrically coupled to the signal pad and a bottom surface electrically coupled to the ground pad. In this way, the transducer can work robustly and may be automatically mounted to an imaging probe.

Ultrasound transducer and method for wafer level back face attachment

Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array is fabricated by forming an interdigitated structure from a first comb structure with a first sub-element and a second comb structure with a second sub-element. The interdigitated structure is coupled to a base package, a matching layer, and a backing layer to form a plurality of multi-frequency transducers.

Methods and systems for multi-frequency transducer array fabrication

Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array may be fabricated via a wafer scale approach, where a first comb structure, with a first type of element, is formed by dicing a first acoustic stack and a second comb structure, with a second type of element, is formed by dicing a second acoustic stack. Combining the first and second comb structures may form a multi-frequency transducer array.

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Queen Creek, AZ, United States of America

Jason Barrett