Intermec, Inc.

Microsoft Technology Licensing, LLC

Jason Allen Harrigan

Pavel Nikitin

Stephen J Kelly

Rene D Martinez

David W Gilpin

Shashidhar Ramamurthy

Gregory Alan Raven

David Bennett Johnson

Andrew James Hillenius

A thermal management device includes a fin pack and a plurality of channels. The fin pack has a hot side and a cold side, and the plurality of channels in the fin pack provide fluid communication from the hot side to the cold side. The channels have a transverse dimension and a longitudinal dimension, and the longitudinal dimension is at least 2.5 times the transverse dimension.

Systems and methods for electromagnetic shielding of thermal fin packs

An EMI attenuation device includes a housing stator, a fan rotor, and an electrical bridge therebetween. The housing stator has an aperture therethrough, and at least a portion of the housing stator is electrically conductive. The fan rotor is adjacent to the aperture and has a rotational axis relative to the housing stator and a proximate surface proximate the housing stator. The fan rotor is electrically conductive, and the proximate surface is continuous around a rotational direction of the fan rotor. The electrical bridge is between the proximate surface of the fan rotor and a contact surface of the housing stator.

Systems and methods for electromagnetic shielding of rotating components

An electronic assembly includes a first printed circuit board (PCB), a second PCB, and a grounding shield. The first PCB includes a first plurality of electronic components and a first conductive layer. The second PCB includes a second plurality of electronic components and a second conductive layer. The grounding shield is electrically connected between the first conductive layer of the first PCB and the second conductive layer of the second PCB to electrically connect the first PCB and the second PCB. The first PCB and the second PCB are arranged in a stack such that the first conductive layer and the second conductive layer mutually shield at least one of the first plurality of electronic components and at least one of the second plurality of electronic components from electromagnetic interference.

Mutually shielded printed circuit board assembly

An electronic assembly includes a printed circuit board (PCB) and an electromagnetic interference (EMI) shield. The PCB includes a plurality of electronic components and a plurality of electrically-conductive traces. The EMI shield is sized and shaped to form a perimeter around at least one of the plurality of electronic components on the PCB. The plurality of electrically-conductive traces cross the perimeter formed by the EMI shield. The EMI shield includes a plurality of decoupling, filtering, or matching components electrically connected between the EMI shield and the plurality of electrically-conductive traces such that the plurality of decoupling, filtering, or matching components are configured to shunt signal noise from the plurality of electrically-conductive traces. The EMI shield is electrically connected to the PCB via the plurality of decoupling, filtering, or matching components to encapsulate and electromagnetically isolate the plurality of electronic components.

Electromagnetic interference shield with integrated decoupling

The present disclosure relates to a printed circuit board (PCB) device and methods for fabricating a PCB device. In some aspects, the PCB device can comprise a surface or internal layer including one or more electrically conductive traces configured to carry a signal or power plane. The PCB device can also comprise at least one thin film comprising an electrically insulating material disposed on the surface or the internal layer. Additionally, the PCB device can comprise one or more electrically conductive layers on the at least one thin film. In some aspects, the one or more electrically conductive layers and the one or more electrically conductive traces can be separated by the at least one thin film in a configuration that defines a capacitive frequency response between the one or more electrically conductive layers and the one or more electrically conductive traces.

Method and apparatus for circuit board noise shielding and grounding

A radio frequency identification (RFID) transponder may include a substrate and a device. The substrate may be in communication with a controller and an antenna, and the antenna is arranged to receive radio frequency signals. A first side surface of the substrate may include a capacitor. The device may be detachably coupled with the substrate via a conductive member positioned between the structure and the capacitor of the substrate, and the conductive member may be within a desired proximity of the capacitor. The structure may be attached to an attachment surface so that an attachment strength between the structure and the attachment surface may be greater than a force required to decouple the structure from the substrate. When the structure is decoupled from the substrate, the conductive member separates from the capacitor, disabling the transponder.

RFID tag with anti-tamper assembly

Systems and methods for a distributed antenna network are provided. One system includes a plurality of antenna modules coupled via a communication line, with each antenna module configured to be switched between a through state and a connected state using radio-frequency identification (RFID) control signals. The system further includes a plurality of antennas, with each antenna connected to a corresponding antenna module. A controller is coupled to the communication line and configured to transmit RFID control signals to the plurality of antenna modules to selectively activate one of the antenna modules by switching the antenna module to the connected state to thereby activate an antenna connected to the antenna module in the connected state.

Systems and methods for controlling antennas

Systems and methods for antenna pattern measurement are provided. One system includes a plurality of wireless sensors arranged in an array, wherein the wireless sensors are configured to be powered by radio-frequency (RF) signals at different power levels. The system also may include a controller configured to wirelessly transmit the RF signals at different power levels and measure responses from the wireless sensors at the different power levels. The system may further include a processor configured to calculate a radiation pattern of an antenna under test using the measured responses.

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Sultan, WA, United States of America

Jason Allen Harrigan