Saint-gobain Ceramics & Plastics, Inc.

Jason Alexander Sherlock

Douglas Edwin Ward

Lin Fu

Long Huy Bui

Abhaya Kumar Bakshi

Angela Wamina Kwapong

Douglas E Ward

A composition suitable for chemical mechanical polishing a substrate can comprise abrasive particles, a multi-valent metal borate, at least one oxidizer and a solvent. The composition can polish a substrate with a high material removal rate and a very smooth surface finish.

Composition and method for conducting a material removing operation

A fluid composition suitable for chemical mechanical polishing a substrate can in include a multi-valent metal borate, at least one oxidizer, and a solvent. The fluid composition can be essentially free of abrasive particles and may achieve a high material removal rate and excellent surface finish.

Fluid composition and method for conducting a material removing operation

The present disclosure is directed to a fluid composition that can be used in chemical-mechanical polishing processes of inorganic material. The fluid composition can include at least one oxidizing agent and a multivalent cation component. Using the fluid composition during a chemical-mechanical polishing process can facilitate a relatively defect free material surface after polishing while achieving a suitable material removal rate.

Oxidizing fluid for the chemical-mechanical polishing of ceramic materials

A method for cleaning the glass surface of solar panels which employs the use of highly efficient sequestering agents and allows to replace deionized water with municipal or fresh water of up to a very high water hardness, without having a loss in the long term power output of the solar panels.

Method of cleaning solar panels with a composition comprising an organic phosphoric acid or an organic phosphonic acid or salts thereof as sequestrant

The disclosure is directed to a processing fluid including at least 50 wt % of an aliphatic hydrocarbon having an average chain length of 8 to 16 carbons, 0.005 wt % to 10.0 wt % of Lewis active components, and not greater than 1.0 wt % water. The Lewis active components includes a Lewis acid and a Lewis base. The processing fluid has a conductivity of at least 10 nS/m and a Cannon viscosity of about 0.5 cp to about 5 cp at 25&#xb0; C.

Conductive hydrocarbon fluid

The disclosure is directed to a processing fluid including an aliphatic hydrocarbon component having an average chain length of 8 to 16 carbons and about 0.0001 wt % to about 50.0 wt % of a Lewis active component.

Aqueous slurry compositions for use in loose-abrasive machining processes, particularly aqueous abrasive slurries for use in wire saw processes. These aqueous slurry compositions comprise abrasive particles uniformly and stably dispersed in lubricant, which comprises a combination of a vehicle and water, particularly PEG and water.

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Anaheim, CA, United States of America

Jason Alexander Sherlock